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| Laser Type | Nanosecond Green Laser |
| Processing Area | 250mmx100mm (Customized) |
| Machine Size | 2040mmx1400mmX1700mm |
| Processing Accuracy | ±0.02mm |
| Machine Power | 1.5KW |
| Weight | 2500KG |
| Environmental Condition | Humidity: 30% to 60% without condensation; Temp: 22ºC ± 2 |
Fully automated SD card laser cutting equipment constitutes a high-precision, high-efficiency industrial automation system, primarily deployed in semiconductor packaging, memory chip manufacturing, and electronic component micro-machining sectors.
Memory Chip Packaging and Testing: Wafer Cutting for NAND Flash into individual SD units. Laser cutting eliminates mechanical stress, enhancing yield rates.
Miniaturised Electronics Manufacturing: Precision cutting of FPCB for mobile phones, cameras, and IoT devices. Ideal for wearables and drones.
Recycling and Data Destruction: Physical chip destruction ensures data security and compliance with electronic waste standards.







