Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

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Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

Customization:	Available
After-sales Service:	Provided
Warranty:	12 Months

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Product Description

Basic Information

Model NO.

GLC-01

Application

Home Appliance, Automotive, Environmental

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Metal, Brittle Materials

Laser Source

532nm Green Laser, 30W

Motion System

Linear Motors (X/Y-Axis)

Dimensions

1410 × 1350 × 2070mm

Weight

1090kg

Cutting Precision

±0.05mm

Product Description

Our Precision Green Laser Cutting System represents the forefront of laser processing technology for brittle and heat-sensitive materials. Utilizing a specialized 532nm wavelength laser source, this machine delivers exceptional cutting precision with minimal thermal impact, making it ideal for high-value manufacturing applications in electronics, medical devices, and advanced materials processing.

Technical Parameters

Parameter	Specification
Laser Type	Green Laser (532nm)
Laser Power	30W
Cutting Precision	±0.05mm
Cutting Width	<0.15mm
Processing Area	150×150mm (Customizable)
Control Mode	Automatic
File Format	DXF
Cooling Method	Water-cooled
Power Supply	220V/50Hz

Industry Applications

Industry	Application Details
Electronics	PCB cutting, semiconductor processing
Medical Devices	Precision component manufacturing
Advanced Materials	Ceramic drilling, diamond cutting
Research & Development	Material processing experiments
Precision Manufacturing	Glass perforation, brittle material processing

Core Technical Configuration

Laser Source: 532nm Green Laser, 30W

Structure: Integrated Sheet Metal + Marble Platform

Motion: Linear Motors (X/Y) + Ball Screw (Z)

Vision: Custom CCD Monitoring System

Software: KY-URCutting Motion Control

Extraction: Custom Smoke Extraction System

Detailed Performance & Photos

Performance Characteristics

Cutting Performance

Smooth edges and burr-free finishing.
Minimal heat-affected zone (HAZ).
High-precision motion control.

Operational Features

Fully enclosed protective cabinet for safety.
Marble base for vibration-free operation.
Rotatable processing platform flexibility.

Frequently Asked Questions

What materials are best suited for the GLC-01 system?

The system is specifically designed for brittle materials (like glass or ceramics), high-hardness metals, and thermal-sensitive substrates where minimal heat impact is required.

What is the advantage of using a 532nm Green Laser?

The 532nm wavelength offers a smaller focal spot and lower thermal effect compared to IR lasers, allowing for much higher precision and cleaner cuts on delicate materials.

How accurate is the cutting process?

The machine achieves a cutting precision of ±0.05mm, supported by a high-precision linear motor motion system and a stable marble platform.

Is the processing area customizable?

Yes, while the standard processing area is 150×150mm, we offer customization options to meet specific customer requirements.

What are the installation requirements for this machine?

Due to the precision nature of green laser processing, it is highly recommended to install the equipment in a clean room environment with a stable 220V/50Hz power supply.

What kind of software control does the system use?

The system utilizes the KY-URCutting professional motion control software, which supports DXF file formats for seamless integration with design workflows.