Brief Description:

Applicable for digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC, and more. Highly efficient for marking on Rigid and flexible printed circuit boards (PCBAs). Supports 1D barcodes, 2D Matrix, QR codes, logos, and batch number marking.

• Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, and intelligent vision system for direction and sampling inspection.
• Friendly HMI (Human-Machine Interface) for ease of operation.
• Imported double-head 20W fiber laser marking system; Green, UV, and CO2 laser sources are optional.
• Equipped with a special fume removal device to protect the marking area and environment.
• Full compliance with CE MARK and SEMI standards.

Our equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers. We aim to control the procurement of the highest cost-effective products for customers, ensuring reliable payment collection and risk avoidance.

Main Product Line: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines (Si/Sic, Lt/Ln Wafer), Laser Annealing Machines, and Automatic Dicing Saw Machines.