Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production and stricter quality requirements, fully automatic lead wire bonding machines with high efficiency, accuracy, and consistency in bonding quality have become essential process equipment for microwave integrated component manufacturing.

The fully automatic lead wedge welding bonding machine is mainly used to achieve a solid electrical connection between two solder pads on the device. It is widely used in semiconductor devices, hybrid circuits, microwave devices, and components. Features include high bonding efficiency, high precision, multiple types of solderable gold wires, controllable lead arc, and machine vision teaching.