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| Functional Configuration | Technical Parameters |
|---|---|
| Model | AP-460 |
| Dimensions (mm) | L=1000, W=1200, H=1650 |
| Weight (kg) | 360 |
| Control System | Industrial PC + Motion Control Card |
| Conveyor | Special aluminum alloy conveyor + Stainless steel chain |
| Max. Moving Speed | 300 mm/s |
| Working Area (mm) | X=460; Y=460; Z=100 |
| Processing Accuracy | ±0.4 mm |
| Power Supply | 220 V 50-60 Hz |
| Gas Supply Type | Compressed air or nitrogen |
| Required Air Pressure | 4 kg/cm² |
Established in 2019, our operations focus on the international trade and integration of semiconductor industry equipment. Currently exported to over 30 countries with a network of over 200 customers and suppliers, we aim to provide the most cost-effective solutions while ensuring risk avoidance for all partners.
Main product range includes: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, Laser Internal Modification Machines, and Automatic Silicone Dispensing Equipment.

