🛠️ Product Description
The production process equipment and application of silicon carbide materials are the core industries focusing on third-generation semiconductor technology. Relying on independently developed core processes and equipment such as long crystal furnaces, laser glass equipment, and epitaxial furnaces, we integrate resources to provide customers with integrated solutions for silicon carbide materials, processes, and equipment systems, helping the rapid development of the third-generation semiconductor industry.
SiC material preparation equipment and production line
SiC power devices are used in electric vehicles, charging piles, photovoltaic inverters, high-speed rail, rail transit, smart grid, industrial power supply and other fields, and can gradually replace silicon based MOSFET and IGBT.
| Field |
SiC Device Advantages |
Comparison with Si Devices |
Typical Applications |
| Electric Vehicles (EVs) |
- Higher efficiency: 5-10% longer range due to lower switching losses. |
Superior high-temperature and high-voltage performance. |
Inverters, On-board Chargers (OBC), DC/DC Converters. |
SiC chip production line
SiC chip and module
Product: SiC Schottky diode chip, silicon carbide MOSFET chip and module.
Application area: The application fields of the third generation semiconductor materials and devices include power grid, electric traction, power supply, electric vehicles, household appliances, medical equipment and consumer electronics. SiC products are mainly used in photovoltaic, electric vehicle charging piles, power electronic transformers and other fields.
🌍 Exhibition & Customers
Established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers.
Main products: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine (Wafer Packaging)), Automatic Silicone Dispensing Equipment.
❓ FAQ
Q1: How to choose a suitable machine?
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2: What is the warranty period for the equipment?
One year warranty and 24 hours online professional technical support are provided for all our equipment.
Q3: Do you provide installation and training?
Yes, we provide comprehensive technical guidance and training to ensure your operators can handle the equipment efficiently.
Q4: What is the typical lead time for orders?
Lead times depend on the specific machine configuration and current order volume, usually ranging from 4 to 12 weeks.
Q5: Can the equipment be customized for specific requirements?
Yes, we offer customization options for semiconductor equipment to meet your specific production line needs and material requirements.
Q6: How do you ensure product quality during shipping?
We use professional wooden box packaging and customized internal stabilization to ensure the high-precision equipment arrives safely at your destination.
Focus Laser
