Picosecond Laser Ultra-Precision Machining System for Semiconductors

Customization:	Available
Structure:	Vertical Drilling Machine
Layout:	Vertical

Basic Information

Controlling Mode

CNC

Automatic Grade

Automatic

Precision

High Precision

Certification

CE, ISO 9001

Condition

New

Package

Polywood Box

Origin

China

Capacity

1000/ Year

Picosecond Laser Ultra-Precision Machining System

Uses high-power and high-stability UV laser to directly ablate material with μm-level processing aperture and heat-affected zone.
High-speed and high-precision beam deflection control through imported precision galvanometers for micro-hole processing.
Large-format processing realized by a micron-level high-speed linear motor platform.
Electrically adjustable Z-axis adapts to various material thicknesses and specific taper hole requirements.
Super-resolution industrial camera for full-frame error correction, ultra-high-precision focusing, and online measurement.
Marble countertops for enhanced system stability and carefully selected mechanical components for long-term accuracy.
Minimum micropore diameter of 5μm, overall processing accuracy of ±4μm, and processing width of 300*300mm.
Ideal for precision micromachining of metals, ceramics, silicon wafers, glass, and organic materials.

Equipment Application

Technical Specifications

Items	Parameter	FM-UVM3A	FM-UVM3B
Laser Wave	355nm	Standard UV
Laser Power	>3W@40kHz	3-40W optional
Pulse width	15ns@40kHz	Ultra-fine pulse
Galvo Scan area	Range	<50*50mm	<15*15mm
Positioning Accuracy	Precision	≤±3um
XY Travel	Workspace	300300mm (600600mm optional)
Repeatability	Stability	≤±1um
Minimum Spot	Aperture	8um	5um
Processing Materials	Versatility	Glass, organics, metals, ceramics, etc.
Power Supply	Voltage	220V, 50~60HZ, 1 phase
Weight	Mass	1200Kg

Other Product Lines

Packing & Delivery

Standard Warranty: 12 months after shipping.
Extended Warranty: Optional coverage up to 36 months.
Global Support: 24/7 technical assistance and service group.
Training: Free on-site or remote operation and maintenance training.

Factory Profile

Our facility is a technology-driven enterprise specializing in the R&D, production, and sales of industrial and scientific research laser application systems. We provide precision solutions for micro-hole, micro-groove, micro-welding, scribing, cutting, and feature forming.

We have successfully developed systems including Femtosecond and Picosecond laser processing units, Roll-to-Roll thin film processors, and precision drilling systems, serving industries like biomedicine, semiconductors, and new energy.

Frequently Asked Questions

Are you a manufacturing factory?

Yes, we are a factory specializing in drilling and laser machining systems. We also collaborate with partners to provide comprehensive industrial solutions to our clients.

What is the typical delivery time?

We maintain stock for popular items. Standard machines usually require 1-3 months, while customized or special projects may require a longer lead time.

What payment methods do you accept?

We accept standard international payment terms, including T/T and L/C for equipment orders. Tooling and smaller orders can be checked for alternative payment methods.

How do you provide technical support?

We offer 24/7 global technical assistance, including free on-site or remote training for operation and maintenance to ensure system stability.

How quickly can I get a quotation?

We typically respond to inquiries within 1 hour. For standard machine quotations, we provide technical requirements and pricing within 3 days; special projects may take up to a week.

What materials can be processed by this system?

The system is versatile and can handle high-precision micromachining for glass, organic materials, various metals, ceramics, and silicon wafers.