Precision Laser Cutting Solutions for Superior Manufacturing Quality

Customization:	Available
After-sales Service:	Provided
Warranty:	12 Months

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Basic Specifications

Model NO.

YH-QCW

Application

Automotive Industry

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Nonmetal

Structure Type

Gantry Type

Processing Area

300 × 300 mm

Max Ceramic Thickness

< 2 mm

Cutting Speed

20 mm/S @ 1mm Al2O3

Production Capacity

50000

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Ceramic Laser Processing Equipment

The equipment uses a high-energy laser to scrib, drill and cut ceramic materials such as alumina and aluminum nitride.

Key Benefits:

High Precision: Adopt high-precision optical path system and equip with high-stability working platform.
High Yield: High processing yield and good consistency for mass production.
Industrial Grade Design: 7*24 operating conditions to ensure machining accuracy and running stability.
Automation: Automatic loading and unloading, supporting unattended operation.

Parameters	Specifications
Laser type	Fiber laser
Processing format	300 * 300mm (Customizable)
Ceramic thickness	< 2mm
Cut shape	Straight line or custom shapes (CAD-Driven)
Cutting speed	Cutting 20mm/s @ 1mm alumina / Scribing > 75mm/s @ 1mm alumina
Materials	Alumina, aluminum nitride, and other ceramic materials
Air Requirement	0.5-0.8 MPa, air consumption 18m³/h

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Sample Display

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Core Semiconductor Equipment

Expert design and manufacturing of advanced semiconductor production equipment:

Die Bonders: High-precision chip attachment for IC packaging.
Wire Bonders: Reliable interconnects for semiconductor devices.
Laser Processing: Wafer marking, grooving, and cutting (Si, SiC, glass, ceramics).
Wafer Dicing Saws: Precision cutting for MEMS, optoelectronics, and advanced packaging.
Laser Annealing: Systems specifically for Si/SiC wafers.
Automatic Dispensing: High-accuracy silicone & epoxy application.

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Frequently Asked Questions

How do I choose a suitable machine?

You can share your material type, dimensions, and specific functional requirements. Based on our experience, we will recommend the most efficient configuration for your needs.

What is the warranty period for the equipment?

We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.

Which materials can be processed with this laser equipment?

It is specifically designed for technical ceramics like Alumina (Al2O3), Aluminum Nitride (AlN), and other non-metallic materials used in the semiconductor and automotive industries.

Is the processing format customizable?

Yes, while the standard processing area is 300 x 300 mm, we offer customization options to meet specific layout or workpiece requirements.

Can the machine handle complex cutting shapes?

Absolutely. The system is CAD-driven, allowing for the cutting of straight lines, circles, and complex custom contours with high repeatability.

Why choose our laser solutions?

We offer comprehensive OEM/ODM services, industrial-grade stability for 24/7 operation, and high-yield processing capabilities tailored for advanced manufacturing.