a Three-Axis Precision Machining System Capable of High-Speed Precision Etching

Customization:	Available
After-sales Service:	Video Support for Free
Warranty:	1year

Product Overview

StructureVertical Drilling Machine

LayoutVertical

Controlling ModeCNC

Number of Shaft3

Automatic GradeAutomatic

PrecisionHigh Precision

CertificationCE, ISO 9001

ConditionNew

OriginChina

Production Capacity1000/ Year

High-Speed Precision Etching System

A advanced three-axis precision machining system designed for high-speed precision etching across various materials. This system utilizes cutting-edge laser technology to achieve microscopic accuracy.

High-power infrared fiber lasers for material ablation with spots as small as 20μm.
Precision galvanometer control for high-speed etching of localized areas.
Separate gantry XY precision platform for large-format machining.
Electrically adjustable Z-axis for varying material thicknesses and 3D etching.
Marble countertop construction to ensure long-term mechanical stability and vibration dampening.
Capable of processing metals, ceramics, silicon wafers, glass, and organic materials.

Technical Specifications

Category	Parameter	FM-SD50 Value
Laser System	Wavelength	1064 nm
	Power Output	50W
	Modulation Frequency	40~1000kHz
	Beam Quality (M2)	<1.3
Galvanometer	Scan Range	<50*50mm
	Repeatability	<1μm
	Positioning Accuracy	≤±20μm
XY Workbench	Travel Journey	300*300mm (Customizable)
	Repeatability	≤±5μm
	Max Speed	≤200mm/s
Processing	Minimum Aperture	20μm
Size	Dimensions	100010001700mm

Equipment Applications

Packing & Service

Standard Warranty: 12 months comprehensive coverage after shipping.
Extended Warranty: Optional service plans available up to 36 months.
Global Support: 24/7 technical assistance through our dedicated service group.
Free Training: Complimentary on-site or remote operation and maintenance training.

Manufacturing Excellence

As a technology-driven enterprise, we specialize in the R&D, production, and sales of industrial laser application systems. Our expertise lies in precision solutions for micro-holes, micro-welding, scribing, and cutting, with feature sizes ranging from 1 to 500 μm.

We have successfully deployed systems including Femtosecond and Picosecond Ultra-Fine Processing units, serving industries such as biomedicine, semiconductors, new energy, and leading research institutions worldwide.

Frequently Asked Questions

Are you a direct manufacturer?

Yes, we are a dedicated factory manufacturing high-precision drilling and laser machines. We also collaborate with industry partners to provide complete integrated solutions for our clients.

What is the typical delivery timeframe?

For standard hot-item models, we maintain stock for quick dispatch. Standard machine builds typically take 1 to 3 months, while specialized custom projects may require a longer lead time.

What payment methods do you support?

We handle international business professionally and primarily accept T/T (Telegraphic Transfer) and L/C (Letter of Credit) for machine purchases.

How do I receive a technical quotation?

Once you submit your technical requirements, our team usually responds within 1 hour. A detailed formal quotation for standard machines is provided within 3 days, or 1 week for complex custom projects.

What materials can your systems process?

Our precision systems are designed to handle silicon wafers, various metals and alloys, ceramics, glass, and specialized organic materials.

Do you provide global installation and training?

Yes, we offer both remote and on-site training for operation and maintenance. Our global support team is available 24/7 to assist with any technical inquiries.