Explore our state-of-the-art industrial systems designed for ultra-fine micro-machining and component manufacturing.
Engineering excellence, state-of-the-art optical components, and tailor-made high-throughput CNC systems.
Hangzhou Focus Laser Co., Ltd. is a professional manufacturer specializing in advanced laser processing equipment for the electronics and display industries. The company focuses on the development and production of PCB laser cutting machines and glass laser cutting systems, delivering high-precision solutions for micro-electronics manufacturing and optical material processing.
Our ultra-fine beam control technologies are widely applied in PCB depaneling, flexible circuit board (FPC) processing, semiconductor packaging, and precision glass cutting for smartphones, display panels, and high-performance optical components. By integrating fiber laser technology, ultra-fine beam control, and intelligent CNC systems, Hangzhou Focus Laser ensures high cutting accuracy, smooth edges, and minimal thermal damage (Heat Affected Zone) during processing.
The company’s equipment is extensively used in industries such as consumer electronics, semiconductor manufacturing, automotive electronics, and smart display production. It supports both high-volume industrial production and customized precision machining requirements. Hangzhou Focus Laser Co., Ltd. emphasizes innovation, reliability, and engineering excellence. With strong R&D capabilities and strict quality control standards, the company provides OEM and ODM services to meet global customer needs, driving the next wave of precision laser micro-processing technology.
Understanding the physics of ultra-short pulse (USP) lasers and the mechanics of minimal heat-affected processing.
Ultra-short pulse durations (femtosecond and picosecond scales) allow cold ablation, turning solid material directly into gas before heat can transfer to the surrounding structure, eliminating thermal deformation.
By shaping standard Gaussian laser outputs into Bessel beams, our systems achieve high depth-of-focus, allowing single-pass volume slicing of ultra-hard materials such as sapphire and display glass.
High-speed digital galvanometer scanners coupled with linear-motor stages enable ultra-precise tracking. This setup compensates for mechanical vibrations and ensures repeatable slicing trajectories.
| Laser Type / Technology | Pulse Width Duration | Heat Affected Zone (HAZ) | Primary Industrial Materials | Processing Accuracy |
|---|---|---|---|---|
| Femtosecond Laser Slicing | < 400 - 800 fs | Negligible (< 1μm) | Polyimide Film, Ultra-thin Glass, Flexible OLED, Sapphire | ± 1.5 μm |
| Picosecond Laser Cutting | 1 - 15 ps | Very Small (< 5μm) | Display Glass, FPC, Ceramics, Thin-Film Metals | ± 3 μm |
| Nanosecond UV Laser Marking | > 5 - 30 ns | Moderate (< 15μm) | PCB Assemblies, Engineering Plastics, Metals | ± 10 μm |
| Fiber Laser Processing | Continuous / Modulated | Thermal Dependent | Structural Sheet Metal, PV Reclamation Systems | ± 15 μm |
Optimizing manufacturing yields across global consumer electronics, semiconductors, and energy sectors.
Our solutions for 3C display panels utilize picosecond IR and Green lasers to execute stress-free dicing. By controlling micro-crack propagation, our systems eliminate post-process mechanical grinding, saving time and increasing overall yields in smartphone glass and display cover production.
With the rise of foldable smartphones, the demand for cutting complex organic layer stacks like Polyimide (PI) has skyrocketed. Femtosecond lasers enable clean cuts through multi-material layers without delamination, carbonization, or melting at the edges.
For high-quality electronic assemblies, mechanical routing generates stress that damages micro-capacitors and circuit pathways. Our fully automatic laser panel cutting machines deploy dust-free, non-contact slicing to secure component integrity.
As green regulations tighten worldwide, recovering valuable layers from waste PV panels is critical. Our reclamation systems use high-energy thermal laser separations to reclaim glass and silicon wafers, preventing toxic heavy metals from reaching landfills.
Anticipating trends in laser technology to keep our global buyers and wholesale partners ahead of the curve.
Integrating machine-learning cameras to adjust beam focus dynamically, correcting thermal drift and substrate deviations in real-time without operator intervention.
Scaling up power outputs for multi-axis systems, enabling fast wafer-level slicing of sapphire, silicon carbide (SiC), and hard glass substrates for semiconductor packaging.
Transitioning to ultra-short UV wavelengths to enable sub-micron features, which are vital for next-generation medical implants and flexible microfluidic structures.
From optical-grade windows to high-capacity laser markers, explore our full manufacturing range.
Ensuring cross-border regulatory compliance, smooth integration, and round-the-clock technical service.
For international buyers looking to secure wholesale industrial assets from China, compliance and supply-chain logistics are as critical as hardware performance. Our entire manufacturing catalog matches CE, FDA (CDRH), and ISO 9001 regulations. We guarantee safe shipping with specialized vacuum-packed shockproof crates that protect high-precision optical parts from humidity and vibration.
To reduce shipping times, we work with global freight networks, offering flexible FOB, CIF, and DDP shipping options. On the support front, Hangzhou Focus Laser Co., Ltd. provides local installation assistance, remote network diagnostics, and ready-to-ship replacement optical components. This ensures minimal downtime and smooth production runs for our clients worldwide.
Answering key questions on sourcing precision laser systems and specialized optical materials.
Mechanical routers generate physical stress, vibrations, and dust, which can micro-crack sensitive components or lift solder joints. Ultra-short pulse (femtosecond/picosecond) lasers cut without physical contact, minimizing the Heat Affected Zone (HAZ). This approach yields cleaner edges, tighter cutting layouts, and prevents dust buildup on delicate parts.
Sapphire is extremely hard (Mohs 9) and features outstanding thermal stability and chemical resistance. This makes it ideal for protective windows in chemical reactors and vessel illumination. It maintains transparency and structural integrity under conditions that would quickly degrade quartz or tempered glass.
Yes. We specialize in custom setups. We build specialized glass cutting systems, design custom PCBA control components, develop tailored optical paths (like aspherical lens coatings), and write custom APIs to integrate GPS locator systems into mobile platforms.
Plasma surface activation removes microscopic organic impurities and increases surface energy. Applying plasma cleaning before bonding or printing on laser-cut substrates ensures clean interfaces, leading to stronger bonds and highly reliable paint or ink adhesion.
For standard laser marking and cutting setups, the manufacturing turnaround is about 4 to 6 weeks. For custom multi-axis, fully automatic laser panel slicing platforms that require custom CNC configurations, lead times average 8 to 12 weeks, including strict quality assurance trials and calibration protocols.
Inside our fabrication cleanrooms, assembly floors, and optical quality validation labs.
Focus Laser
