Femtosecond Laser Cutting Machine (UV/IR/Green Light)
Cooling System
Water Cooling
Technical Class
Pulse Laser
Applicable Material
Nonmetal
Structure Type
Gantry Type
Laser Classification
Solid Laser
Laser Technology
Laser Flame Cutting
Processing Speed
≤3000mm/S
Equipment Advantages
These laser machines are qualified for various kinds of consumer electronics, such as mobile phones and wearable equipment, which feature strict precision and yield rate requirements. Users can better upgrade to an intelligent manufacturing model with "High Precision, High Efficiency and High Price-Performance Ratio."
- Femtosecond laser, ultra-short pulse processing with minimal heat conduction.
- CCD vision pre-scan & auto target positioning; splicing accuracy ≤±3μm.
- Extra fine laser beam for long term stability and negligible thermal effects.
- Higher single pulse energy enabling precision processing of virtually any solid material.
- Exceptional flexibility for micro cutting of any complex shape.
Application Fields
Materials: UTG, Ceramics, Resins, Stone Materials, Sapphire, Silicon, Copper, Stainless Steel, Various Alloy Materials, Thin Film Materials, Polymer Materials, Composite Materials, etc.
Industries: University Research, semiconductor electronics, aerospace, automotive, biomedical applications, etc.
Working Performance Video
Key Configurations
1. Achieves a positioning accuracy of ±1μm and repeatability of 1μm, guaranteeing consistency in mass production.
2. Kerf width can be controlled below 80μm, down to 5μm, ideal for precision cutting of FPCs, LCP, and PI films.
3. Maintains dimensional errors within 5μm, significantly outperforming conventional systems.
Technical Specifications
| Laser Power | 10W/30W/35W |
Dimensions | 2200*1500*1750mm |
| Working Area | 500*610mm |
Certification | CE |
| Positioning Accuracy | ±1um |
Processing Speed | ≤3000mm/s |
| Processing Accuracy | ≤30um |
Focus Spot | ≤20um |
Service & Quality Commitment
The manufacturing process strictly adheres to ISO9001: 2015 international quality management system standards. With a focus on excellence, the equipment delivers stable performance and high-precision results using advanced ultraviolet and picosecond laser technologies.
Frequently Asked Questions
Q1: What materials can this femtosecond laser machine process?
It is suitable for high-speed cutting and drilling on various organic and non-organic materials, including UTG, ceramics, sapphire, silicon, copper, stainless steel, and various polymer or composite materials.
Q2: What is the positioning and processing accuracy?
The machine achieves a positioning accuracy of ±1μm and a processing accuracy of ≤30um, ensuring extremely high consistency for precision micro-structures.
Q3: How fast can the equipment process materials?
The system supports processing speeds up to 3000mm/s, significantly enhancing production efficiency for industrial applications.
Q4: What is the benefit of using a femtosecond laser over traditional lasers?
Femtosecond lasers use ultra-short pulses that cause almost no heat conduction, resulting in a minimal Heat Affected Zone (HAZ) and chipping, which is crucial for sensitive materials.
Q5: What kind of after-sales support is provided?
We offer a one-year warranty on core components and lifetime technical service. This includes remote video guidance, professional consultation, and a stable supply of genuine parts.
Q6: Does the machine include an alignment system?
Yes, it is equipped with high-resolution CCD vision systems and telecentric lenses for automatic alignment and stitching compensation.
Focus Laser
