Inte Laser Femtosecond Tgv Inductive Etching Equipment for High-Precision Glass Via Drilling and Advanced Packaging

Customization: Available
After-sales Service: 12 Months
Function: Abrasion Resistance, High Temperature Resistance, Anti-Corrosion, Anti-Cold

Product Description

Basic Information

Model NO.YT-R20
DemouldingAutomatic
CertificationFDA, ISO
Warranty12 Months
Laser TypeInfrared Femtosecond
Processing Accuracy±0.001mm
Laser TechnologyUltrafast Femtosecond Laser
Vision SystemIntelligent CCD Vision System
Motion ControlNew Type of Motion Control System
ApplicationTGV Glass Micro-Hole Fabrication
Production Capacity100 sets/Month
TGV Laser Etching Equipment

Technical Specification

Product NameHigh-Precision TGV Laser Etching Machine
Processing Area700*700mm (Customizable)
Equipment Size2000 x 1800 x 1900 mm
Electric Power6KW
Machine Weight4500KG
Temperature Req.22°C ± 2
Working VoltageAC 380V

Product Highlights

Femtosecond Technology
Ultrafast LaserBreakthrough non-thermal etching with minimal heat damage.
Vision System
CCD VisionReal-time monitoring ensuring ±0.001mm precision.
Motion Control
Motion ControlImproved efficiency supporting large quantity batch processing.

Application Areas

Semiconductor

Semiconductor Industry
Ideal for TSV, wafer-level packaging, and advanced chip manufacturing.

Display Panel

Display Panel Industry
Perfect for OLED/LCD panel micro-hole etching.

Electronics

High-end Electronics
Precision components for smartphones and laptops.

Related Advanced Solutions:

Solution 1
Solution 2
Solution 3

Technical Capabilities

R&D Center

Our team specializes in the independent research and development of laser generators, optical devices, and automated system integration. We provide innovative solutions for laser micromachining including:

  • Laser sources and optical systems
  • Advanced processing techniques
  • Technical support and customization
  • System integration for PCB and Semiconductors

Expert R&D Team

With a high percentage of senior engineers and laser industry experts, our R&D capacity is a core competitive advantage. Over 70% of the team holds advanced degrees, including Master's and PhD levels, ensuring state-of-the-art equipment development.

Packing & Delivery

Packing

Packing: International Standard Wooden Case

Shipping: Sea freight is recommended for heavy equipment; International Express available for urgent parts.

Lead Time: 30-45 days for standard models; 45-90 days for customized configurations.

Global Partnerships

Frequently Asked Questions

What is the processing accuracy of the equipment?
The equipment achieves a processing accuracy of ±0.001mm, which is industry-leading for micro-hole etching in semiconductor and display panel manufacturing.
Why is infrared femtosecond laser technology used?
It enables non-thermal etching, which minimizes heat-affected zones and achieves high-quality micro-holes on TGV glass of varying thicknesses without structural damage.
What are the typical yield rates for hole processing?
The system maintains a high yield rate of over 95%, thanks to the integrated intelligent CCD vision system that performs real-time adjustments.
Can the processing area be customized for specific production lines?
Yes. While the standard processing area is 700mm×700mm, it can be fully customized to meet specific substrate sizes or production requirements.
What environmental conditions are necessary for operation?
For optimal stability and precision, the environment should be maintained at 22°C±2 with a humidity range of 30% to 60% (non-condensing).
Which industries benefit most from this TGV etching machine?
It is primary suited for the semiconductor industry (TSV/wafer-level packaging), display panels (OLED/LCD), and high-precision electronic manufacturing.

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