Advanced Laser Overflow Removal System with Innovative Flip Design

Customization: Available
After-sales Service: Provided
Condition: New

Product Description

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Basic Information
Product Name
Automatic Laser Deflashing System
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Features
Guaranteed Quality, Customized Options
Origin
China
OEM/ODM
Service Provided
Product Description
Advanced Laser Overflow Removal System

Key Features

  • Laser scanning and vaporization for deflashing; eliminates the need for chemical softening or high-pressure jetting.
  • Optical shaping technology ensures no damage to tube pins while improving removal efficiency.
  • Dual quad laser head for synchronous front and back side laser deflashing, significantly increasing production capacity.
  • Automatic loading/unloading with intelligent identification, automatic flip, and anti-reverse functions.

Applications

Designed for all types of package moulding and pin deflashing. It is particularly effective for SOT89/SOT223 classes where high-pressure water struggles to remove overflow. It also targets laser deflashing residue on the surface of heat sinks for various power devices.

Technical Specifications
Operating Mode Two-way four-head, synchronous work
Laser Power 50W/100W × 2/4
Undistortion Scan Area 300 × 150mm²
Laser Vaporization Depth 0.004 - 0.2mm (Adjustable)
UPH (Units Per Hour) ≥7500pcs/hr @SOT89
Max Loading Volume 300 strips per load
Repeat Accuracy ±0.05mm
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Exhibition & Customers
Exhibition Display 1
Exhibition Display 2

Expertly engaged in international trade and integration of semiconductor industry equipment. Our equipment is exported to over 30 countries with a network of over 200 customers and suppliers worldwide. We aim to provide high-cost-performance products while ensuring risk avoidance for all parties.

Core Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines (Si/Sic, Lt/Ln Wafers), Laser Annealing Machines, Automatic Dicing Saw Machines, and Automatic Silicone Dispensing Equipment.

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Packaging & Shipping
Packaging Details
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Frequently Asked Questions
How do I choose the most suitable machine?
You can provide details about your work piece material, size, and required functions. Based on our extensive experience, we will recommend the most efficient model for your needs.
What is the warranty period for this equipment?
We provide a one-year warranty along with 24-hour online professional technical support to ensure smooth operation.
What are the advantages of laser deflashing over water jetting?
Laser deflashing uses vaporization, which requires no chemical softening and prevents potential mechanical damage to delicate pins often caused by high-pressure water.
Can the machine handle high-volume production?
Yes, with a UPH of ≥7500pcs/hr (for SOT89) and a loading capacity of 300 strips, it is designed for high-efficiency industrial production.
Is the laser vaporization depth adjustable?
Yes, the laser vaporization depth is fully adjustable between 0.004mm and 0.2mm to suit different packaging requirements.
Does the machine support automatic flipping?
Absolutely. The system includes an intelligent identification and automatic flip function to ensure both sides are processed accurately.

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