Designed for all types of package moulding and pin deflashing. It is particularly effective for SOT89/SOT223 classes where high-pressure water struggles to remove overflow. It also targets laser deflashing residue on the surface of heat sinks for various power devices.
| Technical Specifications | |
|---|---|
| Operating Mode | Two-way four-head, synchronous work |
| Laser Power | 50W/100W × 2/4 |
| Undistortion Scan Area | 300 × 150mm² |
| Laser Vaporization Depth | 0.004 - 0.2mm (Adjustable) |
| UPH (Units Per Hour) | ≥7500pcs/hr @SOT89 |
| Max Loading Volume | 300 strips per load |
| Repeat Accuracy | ±0.05mm |
Expertly engaged in international trade and integration of semiconductor industry equipment. Our equipment is exported to over 30 countries with a network of over 200 customers and suppliers worldwide. We aim to provide high-cost-performance products while ensuring risk avoidance for all parties.
Core Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines (Si/Sic, Lt/Ln Wafers), Laser Annealing Machines, Automatic Dicing Saw Machines, and Automatic Silicone Dispensing Equipment.