High-Performance Modular Laser Annealing System for Sic Applications

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High-Performance Modular Laser Annealing System for Sic Applications

Customization:	Available
After-sales Service:	Provided
Function:	High Temperature Resistance

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Product Description

Basic Specifications

Model NO.

LAM-01

Demoulding

Automatic

Condition

New

Certification

RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Product Name

Semiconductor Equipment

Precision

High Precision

Origin

China

Capacity

100 units/month

Laser Annealing Machine for SiC

Hot Selling Modular Design and Integration Laser Annealing System

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Modular Design: Integrated entire machine compatibility with 4, 6, and 8-inch thin chip wafers.

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Advanced Laser Shaping: Self-developed technology providing highly uniform and stable spot energy.

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Surface Quality: Post-annealing surface is uniform and flat with excellent electrical morphology.

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Environmental Control: Strict oxygen content regulation in the cavity to control surface carbon precipitation.

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Smart Monitoring: Compensation system for optical energy stability and non-annealed surface temperature monitoring.

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SEMI Standards: Equipped with EFEM transmission system and supports SECS-GEM communication.

Category	Specifications & Features
Compatibility	Supports 4", 6", 8" thin-chip SiC wafers
Laser Tech	Self-developed shaping for uniform, stable spot energy
Annealing Quality	Excellent electrical properties; Controlled carbon precipitation
Process Control	Oxygen content regulation for optimized environment

Application Scope: Specifically designed for annealing transition metals deposited on heavily doped silicon carbide (SiC) surfaces to form reliable Ohmic contacts.

Exhibition & Customers

Established in 2019, our operations focus on the international trade and integration of semiconductor industry equipment. Our equipment serves clients in over 30 countries with a network of over 200 customers and suppliers.

Main Product Line: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers), Laser Internal Modification (Si/Sic/Lt/Ln Wafer), Laser Annealing Machine, and Automatic Dicing Saw Machines.

Packaging & Shipping

Frequently Asked Questions

Q1: How do I choose the most suitable machine?

You can provide us with the workpiece material, size, and the required machine functions. Based on our extensive experience, we will recommend the most appropriate system for your needs.

Q2: What wafer sizes are compatible with this laser annealing machine?

The system features a modular design that is compatible with 4-inch, 6-inch, and 8-inch thin chip wafers.

Q3: What is the warranty period for the equipment?

We provide a one-year warranty along with 24-hour online professional technical support to ensure smooth operation.

Q4: Does the machine comply with semiconductor industry standards?

Yes, the entire machine complies with SEMI standards and supports SECS-GEM communication for integrated factory automation.

Q5: How is the annealing quality ensured?

Through self-developed laser shaping technology and strict oxygen content regulation in the cavity, we achieve uniform spot energy and consistent surface morphology.

Q6: What services do you offer for custom requirements?

We provide comprehensive OEM, ODM, and custom design services to meet specific technical or integration requirements.