Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution

1 / 5

Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution

Still deciding? Get samples of $ !

Order Sample

Send Inquiry

Product Description

📊

Technical Overview

Model	YT-2353
Application	Home Appliance, Petroleum Machinery, Aerospace, Automotive, Optical, Glass, Zirconia/Ruby Industry.
Cooling System	Water Cooling
Technical Class	Pulse Laser (Solid Laser / Ultrafast)
Applicable Material	Nonmetal / Gemstones
Structure Type	Gantry Type
Processing Accuracy	± 0.02mm
Production Capacity	100 sets/Month

💎

Product Description

Infrared Sub-picosecond Laser Diamond Cutting Machine

Designed specifically for gemstone manufacturers seeking to scale production, this Dual-Head equipment revolutionizes the cutting of zirconia, diamonds, and precious stones. It delivers unmatched efficiency and precision compared to traditional wire cutting methods.

🚀

Key Highlights

High Material Yield

Finished stone yield rate is over 30% higher compared to wire cutting, significantly boosting profit margins by minimizing kerf loss.

Eco-Friendly

Pollution-free laser process with minimal consumables and a stable industrial software platform.

Versatile Shaping

Handles materials up to 3mm thickness for complex shapes like Oval, Pear, Round, Tapered Baguette, and Marquise.

⚙️

Integrated Configuration

Includes: 4-Head Splitting Equipment

Simultaneous Splitting: Four heads performing linear splitting at the same time.
Precision Thickness Control: High-precision laser splitting for various thicknesses.
Smart Workflow: Easy-to-operate industrial software platform.

📝

Specifications

Laser Type	Infrared Sub-picosecond Laser
Processing Area	600mm x 600mm (Customizable)
Machine Dimensions	1650mm x 1950mm x 2000mm
Total Power Consumption	6.5 KW
Machine Weight	3500 KG / 3700 KG (Gross)
Working Voltage	AC380V
Environment	Temp: 22°C ± 2°C; Humidity: 30%~60%

🎯

Application Areas

Ideal for cutting and shaping:

Synthetic Gemstones: Cubic Zirconia (CZ), Moissanite, etc.
Custom Jewelry Design: Rapid prototyping of unique shapes.
Industrial Ceramics: Precise cutting of brittle hard materials.

🔬

R&D and Production Excellence

Specializing in the independent research and development of laser generators, optical devices, and automation systems to provide innovative solutions for laser micromachining.

📦

Packing & Delivery

Packaging: 1PCS per Wooden Case

Shipping Method: Sea freight is recommended due to heavy weight (3700kg); international express available for urgent requirements.

Delivery Time: 30-45 days for standard goods; 45-60 days for customized orders.

❓

Frequently Asked Questions

How much material can I save compared to traditional wire cutting?

You can expect a finished stone yield rate increase of over 30%, which translates to significant cost savings for high-value materials.

Can this machine cut custom shapes other than round?

Yes, it excels at processing complex shapes including pear, marquise, tapered baguette, and oval for materials under 3mm thickness.

Is the software interface difficult to operate for new users?

No, the machine features an easy-to-operate industrial software platform designed to streamline your workflow and ensure consistent quality.

What are the power requirements for installation?

The machine requires a working voltage of AC380V and has a total power consumption of approximately 6.5 KW.

What is the typical lead time for a new order?

Standard equipment typically ships within 30-45 days, while customized configurations may take between 45-60 days.

Does the sub-picosecond laser require high maintenance?

The system is designed for industrial stability. The laser process is pollution-free with minimal consumables, reducing the need for complex frequent maintenance.