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| Model NO. | YT-R20 |
| Demoulding | Automatic |
| Condition | New |
| Certification | FDA, ISO |
| Warranty | 12 Months |
| Automatic Grade | Automatic |
| Installation | Vertical |
| Driven Type | Electric |
| Mould Life | >1,000,000 Shots |
| OEM&ODM | Accepted |
| Certificate | ISO9001, CE |
| Transport Package | Wooden Case |
| Specification | 2000*1800*1900mm |
| Origin | China |
| Production Capacity | 100 sets/Month |
| Package Size | 240.00cm * 220.00cm * 230.00cm |
| Package Gross Weight | 4800.000kg |
Traditional vs. Laser: A Manufacturing Revolution
Laser technology is not simply a replacement for traditional methods; it is a disruptive upgrade. It has ushered manufacturing from an era reliant on 'physical tools' into a new age of precision, efficiency, flexibility, and sustainability driven by 'photons.'
Edge Quality
The Process
Flexibility and Tools
Work Environment
Material Compatibility
Cost
| Product Name | High-Precision TGV Laser Etching Machine for Glass Substrate in Advanced Semiconductor Packaging |
| Laser Type | Infrared Femtosecond |
| Processing Area | 700*700mm (Customized) |
| Equipment Size | 2000X1800X1900mm |
| Equipment Processing Accuracy | ±0.001mm |
| Electric Power Loading | 6KW |
| Machine Weight | 4500KG |
| Environment Requirements | Temperature: 22°C±2; Humidity: 30%—60% no condensation |
| Working Voltage | AC380V |
Redefining Precision in Glass Interconnects
Unlock the future of advanced packaging with unmatched speed, accuracy, and quality.
• Specialized in advanced laser solutions for the semiconductor industry.
• Comprehensive installation, training, and global support.
• Tailored machines to fit specific factory layouts.
• Built with top-tier components to ensure durability.
Deeply committed to advanced manufacturing technology, providing automated and intelligent laser processing application solutions for a wide range of industries.
We are a technology-oriented enterprise specializing in independent research and development of laser generators, optical devices, and automation system integration.
We provide innovative solutions for laser micromachining including processing techniques, laser sources, and optical systems for industries such as semiconductors, glass, new energy, and solar energy.
Since 2013, our R&D personnel have accounted for more than 41% of staff, including senior engineers and experts. With a strong academic background (Bachelor's, Master's, and PhD levels), we possess robust R&D capabilities for custom laser systems.
Packing: 1PCS/Wooden Case
Shipping: Sea shipping is recommended due to weight. International express is available for urgent needs.
Delivery Time: Standard goods: 30-45 days. Customized goods: 45-90 days after confirmation.
A: The equipment provides extreme processing accuracy of ±0.001mm, making it ideal for high-density semiconductor packaging.
A: By using an infrared femtosecond laser, the machine minimizes the Heat-Affected Zone (HAZ), which prevents micro-cracks and maintains the structural integrity of the glass substrate.
A: The machine is versatile and can process various glass thicknesses for both standard through-holes and complex, custom-shaped patterns.
A: For optimal performance, the machine should be kept in an environment with a temperature of 22°C±2 and humidity between 30%—60% with no condensation.
A: Every unit is securely packed in a robust wooden case to prevent damage during transit, especially for heavy sea freight shipments.
A: Yes, we provide customization options for the processing area and machine configuration to suit your specific production requirements and facility layout.
