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High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing
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High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing
High-Performance Laser Drilling System for Rapid Material Processing

High-Performance Laser Drilling System for Rapid Material Processing

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty
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Product Description

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Overview

Model NO. AT-61166
Origin China
Package Size 150.00cm * 90.00cm * 150.00cm
Gross Weight 2000.000kg
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Product Description

The Laser High-Speed Drilling System is a galvanometer-based precision laser processing equipment that combines high-power fiber laser technology with high-speed precision galvanometer control. It enables ultra-fine, high-speed micro-hole processing on thin sheet materials, with a minimum hole diameter of 0.02mm and positioning accuracy up to 2μm. It is widely suitable for precision drilling needs in industries such as electronics, automotive, aerospace, and medical devices, offering a cost-effective solution for micron-level micro-hole processing.

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Product Features

Utilizes a single-mode fiber laser with excellent reflection isolation and diffraction-limited beam quality for precision drilling and cutting.
High-precision servo cutting head with auto-focus capability, fast response, and high accuracy.
Precision optical path and beam control structure, ensuring superior beam quality and spot control.
Linear gantry dual-drive platform with high stability and acceleration exceeding 1G.
High-precision 5-axis control system with excellent processing path optimization and nesting capabilities.
Ultra-high-speed drilling mode with drilling speeds exceeding 50 holes per second.
High-precision off-axis visual positioning system supporting secondary positioning of parts.
High-flatness marble platform with a fully enclosed structure for long-term stability.
Maintenance-free operation through well-designed cable management and dust removal.
Minimum hole diameter down to 0.05mm with smooth cuts, good perpendicularity, and no slag.
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Product Parameters

Category Parameter FM -LPCD1500/3000
LaserWavelength1060~1080nm
LaserPeak Power1500W (3000W)
LaserModulation Frequency1~50kHz
LaserBeam Quality M²<1.05
LaserPower Stability (8h)<3%
XY StageTravel600*600mm (800*800mm)
XY StageRepeatability≤±0.005mm
XY StagePositioning Accuracy≤±0.02 mm
XY StageAcceleration≤1G
XY StageSpeed≤60m/min
Z AxisTravel150mm
Z AxisRepeatability≤±10μm
Visual PositioningPositioning Accuracy±0.01mm
Processing CapabilityMin Hole Diameter0.05mm
Processing CapabilityProcessing Thickness≤2mm (5mm)
Processing CapabilityDrilling Speed>50 holes/s (0.02~0.2mm)
CoolingCooling MethodAir cooling
PowerPower Supply220V 50~60Hz 20A (40A)
DimensionsSize1500*1600*1900mm
WeightWeight1500Kg
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Detailed Photos

Laser Drilling System 1
Laser Drilling System 2
Laser Drilling System 3
Laser Drilling System 4
Laser Drilling System 5
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Frequently Asked Questions

What materials can be processed with this laser system?
The system is designed for high-speed precision processing of various metals, alloys, and ceramic materials.
What is the maximum drilling speed of the equipment?
The equipment features an ultra-high-speed mode capable of drilling more than 50 holes per second for diameters between 0.02mm and 0.2mm.
Does the system require water cooling?
No, this specific laser high-speed drilling system utilizes an efficient air cooling method for its operation.
Can it handle complex shapes or tube drilling?
Yes, with the addition of a rotary axis, the system enables precise circular tube cutting and drilling.
What is the positioning accuracy of the XY stage?
The XY stage provides a high positioning accuracy of ≤±0.02 mm and a repeatability of ≤±0.005mm.
Is the system suitable for micron-level processing?
Absolutely. It supports a minimum hole diameter (kerf) down to 0.05mm and positioning accuracy up to 2μm, making it ideal for micron-level tasks.

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