High-Precision Laser Wafer Marking System for Semiconductor Manufacturing

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High-Precision Laser Wafer Marking System for Semiconductor Manufacturing

Customization:	Available
After-sales Service:	Online Service
Warranty:	12 Months

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Product Description

Product Overview

Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System is a high-precision, automated system designed for the laser marking of semiconductor wafers. It integrates robotic handling, automatic calibration, and advanced laser marking to ensure efficient and clean processing. The machine supports SECS/GEM communication and can be customized for various marking patterns, including barcodes (SEMI T1) and QR codes, while maintaining ISO Class 2 cleanliness.

Model NO.

HMLY-DB-005

Laser Visibility

Visible

Applicable Material

Metal / Semiconductor

Cooling System

Air / Water Cooling

Laser Wavelength

Fiber / UV / Green Laser

Accuracy

Sub-Micron (<10μm Marks)

Wafer Size

8-12 Inches

Laser Power

4W / 7W / 10W / 15W / 25W

High-Precision Laser Wafer Marking System 1

High-Precision Laser Wafer Marking System 2

Technical Specifications

Parameter	Details
Laser Wavelength	532nm / 355nm / 1064nm
Cooling Method	Water Cooling / Air Cooling
Control System	Galvanometer + Control Card (Windows 7/10)
Supported File Formats	DXF, PLT
Power Supply	Single-Phase 220V, 4KW
Optional Features	QR Code (DM), Custom Marking Designs, FFU Filter

Working Conditions

🌡️ Environment

Temperature: 20-25°C
Humidity: 35-60% (no condensation)

⚡ Utility

Power: 220VAC, 50Hz, 32A
Compressed Air: ≥150L/min, 0.5-0.7MPa

Key Features & Capabilities

🎯 High-Precision Marking

Equipped with specialized lasers for clear and durable wafer markings on Si, SiC, and GaN.

🤖 Automated Handling

Dual-arm robotic system with ±0.1mm repeatability for seamless wafer loading/unloading.

🔍 Auto-Calibration

Integrated 3-second center and angle detection for extremely accurate positioning.

🛡️ Cleanroom Compatibility

Optional FFU (H14 filter, 99.997% efficiency) for ISO Class 2 environments.

Packing & Logistics

All equipment is packed according to IPPC standard wooden packaging to ensure safety during international transit. We provide comprehensive air-freight, truck, and ocean freight services.

Applications

1. Semiconductor Manufacturing: Unique Wafer Marking (UWM) for 8-12-inch wafers (SEMI T1/QR codes).
2. LED & Optoelectronics: Serializing GaN, SiC, and sapphire wafers for Mini/Micro-LEDs.
3. MEMS & Advanced Packaging: Wafer-level identification before dicing.
4. Automotive Power Electronics: Marking SiC and GaN power devices for EV components.
5. R&D: Flexible prototyping and failure analysis in research foundries.

Frequently Asked Questions

What is a Wafer Marking Machine?

It is a high-precision laser system designed to permanently mark wafers (Si, GaN, SiC, sapphire, etc.) with barcodes, QR codes, or alphanumeric IDs for full traceability in semiconductor manufacturing.

Which industries typically use this equipment?

Mainly used in semiconductor fabs, LED & optoelectronics, Solar/PV manufacturing, MEMS packaging, medical bioelectronics, and automotive power modules.

What types of lasers can be integrated?

We offer Fiber Lasers (1064nm) for hard materials, UV Lasers (355nm) for delicate wafers with minimal heat impact, and Green Lasers (532nm) for glass and ceramics.

What is the marking resolution?

The system achieves sub-micron accuracy with a marking resolution down to 10 μm, ideal for miniaturized dies and microelectronics.

Does the machine support automated wafer handling?

Yes, it features a dual-arm robotic handling system and supports SEMI-standard cassette loading for fully automated 8-12 inch wafer processing.

Is the equipment cleanroom compatible?

Absolutely. The system can be equipped with an optional FFU (H14 filter) and dust extraction to maintain cleanliness levels required for ISO Class 2 environments.