Inte Laser C30 UV Picosecond Laser Cutting Machine for COB Substrate & Precision Electronics

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Product Description

🔹 Basic Information
Model NO. C30
Application Environmental Equipment, Petroleum Machinery, Aerospace, Automotive, LED/IC Precision Electronics
Cooling System Industrial Water Cooling
Technical Class Pulse Laser
Applicable Material Nonmetal
Structure Type Gantry Type
Laser Classification Ultrafast Picosecond Laser
Certificate CE, ISO9001
📦 Product Description

Ultrafast UV Picosecond Laser Cutting Machine for COB Substrate & Precision Electronics

Picosecond Laser Cutting Machine
Product Name Ultrafast UV Laser Cutting Equipment
Processing Area 260mm × 260mm (Customizable)
Machine Accuracy ±0.02mm
Total Power 6 KW
Machine Weight 2500 KG
✨ Technical Highlights

Achieve Perfect, Damage-Free Cuts for High-End Electronics

The C30 UV Picosecond Laser Cutting Machine is engineered for the precision-driven world of LED and IC manufacturing. It delivers micron-level cuts on delicate COB substrates and electronic components without the heat damage associated with traditional methods.

Feature Traditional Cutting C30 Picosecond Laser
Precision ±0.1mm ±0.02mm (5x Higher)
Edge Quality Burrs, Cracks Perfectly Burr-Free
Heat Affected Zone Significant Deformation Almost Zero
Post-Processing Grinding Required Ready to Use

Related Precision Models:

Laser Model 1
Laser Model 2
Laser Model 3
🔍 Application Areas
📺

LED Display

Precise ablation of COB substrate insulating layers, LED chip cutting, and high-density array processing.

📟

IC Packaging

High-precision cutting for IC substrates, supporting advanced packaging like flip-chip and BGA.

📱

Consumer Electronics

Precision cutting for smartphones, tablets, and wearables where miniaturization is critical.

Application 1
Application 2
Application 3
Application 4
Application 5
🏢 Technical Strength

Our focus is on the independent research and development of laser generators, optical devices, and integrated automation systems. We provide innovative solutions for laser micromachining, including processing technology and advanced laser sources for industries such as printed circuit boards, semiconductors, and new energy batteries.

Research Facility
🔬 Research & Development Center
R&D 1
R&D 2
R&D 3
🚢 Packaging & Shipping
Packaging

Packing: 1 Set / Wooden Case

Shipping Methods: Primarily by sea due to heavy weight. International express is available for urgent needs.

Delivery Time:
• Standard models: 30-45 days.
• Customized solutions: 45-60 days.

🤝 Global Clients
Client List
❓ Frequently Asked Questions
Which industries is this laser cutting machine suitable for?
It is ideal for LED displays, IC packaging, semiconductor fabrication, and automotive electronics.
Does the machine cause thermal damage to delicate materials?
No, the ultrafast UV picosecond laser uses a non-contact process that minimizes thermal stress, resulting in almost zero heat-affected zones.
What is the processing accuracy and edge quality?
The machine offers a precision of ±0.02mm, producing micron-level smooth, burr-free edges that require no post-processing.
Is the processing area customizable for specific needs?
Yes, while the standard area is 260mm × 260mm, it can be customized according to your specific production requirements.
What kind of maintenance does the cooling system require?
The machine uses an industrial water cooling system. Regular checks on water levels and cleanliness are recommended to ensure stable laser performance.
What is the typical lead time for an order?
Standard equipment typically ships within 30-45 days, while customized machines take approximately 45-60 days after deposit.

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