Focus Laser
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A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure uniform adhesion.
The wafer laminating machine coats blue film or UV film on the wafer and the FRAME iron ring, fixing them together. This equipment can stretch and cover films on semiconductors (wafer, glass, LED, PCB) and provides protection during surface lift-off processes.
| Specification Item | Details |
|---|---|
| Dimension | L933*W450*H317mm |
| Compatible Size | 6"~8" |
| Total Power | 500W |
| Input Power Supply | 100-240V AC 50-60HZ |
| Air Pressure | 0.5-0.8Mpa |
| Film Type | Blue film / UV film |
| Plate Heating Temperature | 0~65ºC |
| Film Thickness | 0.05~0.2mm |
| Film Function | Manual |
| Cutting Function | Manual rotary |
1. Set vacuum time (15s), laminating (35s), and temp (40ºC).
2. Start pre-heating in "Automatic" mode.
3. Open the lamination door and place the mould.
4. Align the glass/wafer with the frame on the LCD.
5. Put lamination mould in place and close the lid.
6. Press start, wait for automatic exhaust, and remove the finished screen.
Wafer Dicing Preparation: Mounting wafers onto frames to hold dies during cutting.
Solar Panel Manufacturing: Encapsulation of PV cells with EVA/POE films.
Electronics & Displays: OLED/QLED display encapsulation and touch panel bonding.
PCBs: Multi-layer PCB and flexible circuit bonding for wearables.
Materials: Hardened plywood crate, shock-absorbing foam, desiccant, and anti-corrosion strips.
Freight: Available via Air-freight, sea-freight, or railway.
