Hangzhou Focus Laser Co., Ltd. stands as a professional cornerstone manufacturer in the global optoelectronics landscape. We specialize in developing state-of-the-art laser processing equipment tailored specifically for the electronics and display industries. Our core expertise lies in the engineering of high-precision PCB laser cutting machines and glass laser cutting systems, delivering industrial-grade solutions for micro-electronics manufacturing and intricate optical material processing.
Integrating fiber laser technology with ultra-fine beam control and intelligent CNC systems to ensure high cutting accuracy with smooth edges.
Focusing on "Cold Processing" via Picosecond and Femtosecond lasers to minimize thermal damage in semiconductor packaging.
A reliable partner for global enterprises, providing customized precision machining solutions from our advanced factory in China.
The global laser technology market is currently undergoing a paradigm shift. As consumer electronics move towards miniaturization and higher functional density, traditional mechanical cutting tools are being replaced by high-energy laser beams. In the 3C display panel and semiconductor sectors, the demand for zero-thermal-effect processing has propelled UV and Ultrafast lasers to the forefront of industrial demand.
As smartphones and wearable devices become thinner, PCB depaneling requires the sub-micron accuracy that only laser technology can provide without damaging delicate components.
Advanced materials like sapphire, tempered glass, and polyimide (PI) films used in flexible displays require specialized laser wavelengths to achieve clean, burr-free cuts.
Modern laser systems are no longer standalone tools; they are integrated with AI-driven CNC systems for automated defect detection and real-time adjustment.
Laser processing is a "clean" technology—reducing material waste and eliminating the need for chemical etching or mechanical coolants, aligning with global green manufacturing standards.
High-volume manufacturing of smartphone screens and tablets requires the Glass Laser Cutting/Splitting Integrated Machine to prevent micro-cracks during the separation process.
Processing rigid-flex PCBs for ADAS systems and smart dashboards. Our UV Picosecond machines ensure high reliability in safety-critical electronic components.
Femtosecond laser systems are essential for thin wafer dicing and MEMS device fabrication, where traditional methods fail due to material brittleness.
As a leading Chinese supplier, Hangzhou Focus Laser leverages a robust local supply chain and a deep talent pool in laser physics and software engineering. Our advantages include:
Our technologies are widely applied in PCB depaneling, flexible circuit board processing, and precision glass cutting. By integrating fiber laser technology, ultra-fine beam control, and intelligent CNC systems, we ensure minimal thermal damage. This is particularly vital for UV Picosecond Laser Cutting applied to flexible circuit boards (FPC), where traditional CO2 lasers might cause carbonization or edge peeling.
In the past, industrial laser applications were dominated by nanosecond pulses. However, as the industry demands higher precision, Hangzhou Focus Laser has pioneered the use of Femtosecond Lasers. These "Ultrafast" lasers operate on a time scale so short that heat does not have time to transfer to the surrounding material—a process known as Cold Ablation. This is the gold standard for MEMS devices and high-quality thin wafer cutting.
Hangzhou Focus Laser Co., Ltd. emphasizes innovation, reliability, and engineering excellence. With strong R&D capabilities and strict quality control standards, the company provides OEM and ODM services to meet global customer needs. Continuously advancing laser micro-processing technology, it aims to become a leading global supplier of precision laser solutions for PCB, glass, and advanced electronic manufacturing applications.
Focus Laser
