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Home > FPC (Flexible PCB) Laser Cutting Equipment > Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
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Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut
Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut

Hot Sale UV Picosecond Laser Cutting Machine for Flexible Circuit Board Cut

Customization: Available
Warranty: 12 Months
Application: Aerospace Industry, Automotive Industry, Semiconductors/3c
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Product Description

Basic Specifications
Model NO.
CS-0605-V-A
Cooling System
Water Cooling
Technical Class
Pulse Laser
Applicable Material
Nonmetal
Structure Type
Gantry Type
Laser Technology
Laser Flame Cutting
Laser Type
Ultrafast Laser
Laser Power
30W
Working Area
500*610mm
Positioning Accuracy
1um
Processing Speed
3000mm/S
Certification
CE
Picosecond Laser Cutting Machine (UV/IR/Green Light)

We provide comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision cutting, ultra-thin PCB cutting, high-resolution marking, plating removal, metal deep engraving, and micro-hole machining. Our laser solution offers a processing accuracy of ±5 micrometers, satisfying the miniaturization requirements of electronic components with non-contact processing that poses zero damage to the product.

Laser Cutting Machine
Equipment Advantages
◈
"Cold" Processing: Ultra-short pulse lasers achieve minimal HAZ (Heat Affected Zone) without the need for auxiliary processing.
◈
Precision & Stability: Equipped with a linear motor driver system and marble platform for high-speed stability.
◈
Automatic Alignment: High-resolution CCD guarantees accurate positioning during cutting.
Processing Sample 1
Processing Sample 2
Processing Sample 3
Technical Specifications
Laser Power30W Dimensions2200*1500*1750mm
Working Area500*610mm CertificationCE
Positioning Accuracy1um Processing Speed3000mm/s
Processing Accuracy30um Focus Spot20um
Application Fields

Widely deployed in sectors including mobile, communication, consumer electronics, semiconductors, and biomedical. Suitable for precision cutting, drilling, and etching on flexible OLED, LCP, PI film, FPC, nanogold, polarizer, and cover films.

Application 1
Application 2
Packaging & Shipping
Packaging 1
Packaging 2
Packaging 3
Frequently Asked Questions
What can this equipment do for my production?
We provide advanced equipment and technical solutions to help improve production efficiency, reduce costs, and optimize product quality in industries like 3C electronics and semiconductors.
Are you a manufacturer or a trade company?
We are a manufacturer with independent research, development, and manufacturing capabilities, specializing in high-precision laser technology.
What is the typical delivery timeframe?
Standard delivery is approximately 35 days after the receipt of payment, depending on the specific configuration.
What kind of after-sales service do you provide?
We offer a one-year warranty and lifetime service. During the warranty, we provide free repairs and replacement parts for non-human-related malfunctions.
Can we apply to be a global agent?
Yes, we warmly welcome global agents. We provide full technical support, professional solutions, and favorable discount policies for our partners.
Does the machine support large-area processing?
Yes, an optional extra-large field telecentric lens supports a maximum single processing area of 200×200mm, allowing for large-area processing without stitching.

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