Automatic Dual-Head Roll-to-Roll Coverlay High-Speed FPC/Flex PCB Coverlay Laser Cutting Machine

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Product Description

FPC/Flex PCB Coverlay Laser Cutting Machine
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Basic Information

Model NO.MLPC30A-C
ApplicationHome Appliance, Petroleum Machinery Manufacturing, Aerospace Industry, Automotive Industry, FPC, PCB, 5G Materials, Flexible OLED Displays etc.
Cooling SystemWater Cooling
Technical ClassPulse Laser
Applicable MaterialNonmetal
Structure TypeGantry Type
Laser ClassificationSolid Laser
Laser TechnologyUltrafast Laser
CertificatesCE, ISO9001
Production Capacity100 sets/Month
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Specifications

Laser TypeNanosecond UV, Picosecond UV, Nanosecond green laser
Processing Area2X250mmX500mm (customized)
Machine Dimensions2350mmX1450mmX2200mm
Processing Accuracy± 0.03mm
Total Power Consumption3 KW
Machine Weight2000 KG
Table Size520mm x 2200mm
Environment RequirementsTemperature: 22°C ± 2°C; Humidity: 30%~60%
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Product Highlights

Dual-Head Efficiency
Roll-to-Roll Processing
Smart Automation
Dual-Head Efficiency
Dual-head design allows for simultaneous processing, effectively doubling your production speed. High-speed synchronization ensures both heads work in perfect coordination.
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Continuous Roll-to-Roll
Roll-to-Roll (and Roll-to-Sheet) system handles continuous material feeding automatically. Uninterrupted workflow from feeding to collection.
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Smart Automation
Intelligent management of feeding, trimming, counting, and sorting. Automatically replaces part numbers and collects finished products.
High-Speed UV Laser Technology
Equipped with advanced UV lasers ensuring:
  • Burr-Free Cutting: Smooth edges even at high speeds.
  • Precision: Maintains high accuracy (±0.02mm).
  • Stability: Consistent energy delivery for every cut.
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Application Areas

Perfect for manufacturers requiring speed and high volume in the following areas:

  • Mass Production of FPC Coverlay Laser Cutting
  • Mass Production of Flex PCB Coverlay Laser Cutting
  • High-Volume FPC Cover Film Processing
  • Printed Circuit Board (PCB) Cutting
  • Cover Layer Laser Cutting
  • Flexible Circuit Board Processing
  • Electronic Circuit Manufacturing
UV CO2 Laser Drilling
SD Card Laser Cutting
TGV Laser Etching
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Company Profile

Company Facility

We are a technology-oriented enterprise specializing in independent research and development of laser generators, optical devices, and automation system integration. As a four-dimensional integrated equipment manufacturing company, we provide innovative solutions for laser micromachining applications.

Our expertise spans across processing technology, laser sources, and optical systems, creating value for clients in printed circuit boards, semiconductors, glass, new energy, and solar energy industries.

R&D Center
Service Center
Production Base
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Research and Development Team

Team 1
Team 2
Team 3
Design Center
Laser Lab
R&D Laboratory
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Packing & Delivery

Wooden Case Packing
  • Packing: 1PCS/Wooden Case
  • Shipping Method: By sea or by international express. Given the weight, sea freight is recommended for cost-efficiency.
  • Delivery Time: Standard goods: 30-45 days; Customized goods: 45-60 days after deposit.
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Our Clients

Client Logos

Frequently Asked Questions

What industries is this equipment designed for?
It is specifically designed for FPC (Flexible Printed Circuit) and PCB (Printed Circuit Board) Coverlay laser cutting, including coverlay film, FPC cover film, and CVL laser processing.
How does it compare to traditional punch die machines?
Our equipment replaces traditional punch dies with high-precision laser cutting. It features dual-head synchronous cutting and roll-to-roll processing, providing higher efficiency, burr-free edges, and ±0.02mm precision.
What is the level of automation?
The machine is fully automated, covering feeding, cutting, counting, and collection. A built-in power optimization system ensures stable processing with minimal manual intervention.
Can the processing area be customized?
Yes, the processing table can be customized up to 520mm × 2200mm to accommodate various FPC/PCB Coverlay sizes and production requirements.
How much does the dual-head design improve efficiency?
The industry-first dual-head roll-to-roll design offers over 300% efficiency improvement compared to traditional single-head machines, making it ideal for mass production.
What laser types are supported?
The system supports Nanosecond UV, Picosecond UV, and Picosecond Green lasers to handle a diverse range of FPC and Flex PCB Coverlay materials.

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