The UV laser marking machine belongs to the advanced series of laser marking technology, developed utilizing a 355nm UV laser generator. By adopting three-order intracavity frequency multiplication technology, the 355 UV focusing spot is significantly smaller than traditional fiber lasers. This precision greatly reduces mechanical deformation and minimizes heat influence on processed materials. It is primarily designed for ultra-fine marking and engraving, making it ideal for food packaging, medical materials, micropores, high-speed glass division, and complex silicon wafer graphics.

• Capable of marking characters as small as 0.1mm and penetrating 10um micropores.
• Excellent marking effect on high polymer materials and plastics that are difficult for infrared lasers.
• Zero residue, carbonization, or deformation during the process; results in a smooth finished surface.
• Equipped with a closed safety cover, ensuring an environmentally friendly workspace that meets export standards.

• Electronic products logo and component marking.
• Mobile accessories, computer fittings, and flexible PCB marking.
• Food industry, PVC pipes, and Pharmaceutical packaging (HDPE/PO/PP).
• Coating removal from metal and non-metal surfaces.
• Processing micropores in silicon wafers or fire-proof materials.

To ensure our machinery meets your specific application needs, we provide free sampling on your materials using our in-house facility.

With 17 years of R&D and manufacturing experience, our company has accumulated over 3000 successful cases in domestic and overseas markets. We specialize in "Laser + Intelligence" solutions, integrating mechanical, electrical, and CCD vision units to realize full production line automation.

Packing: Anti-collision foam + wrapping film + Export standard wooden case.

Shipping: Primary method by sea; options for air or railway transportation are available.