Advanced Laser Micro-Machining System/High-Precision Laser Micro-Machining

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

Basic Specification

Model Information

Model NO.: AT-61157
Origin: China

Packaging & Delivery

Package Size: 50.00cm * 60.00cm * 50.00cm
Gross Weight: 30.000kg

Product Description

  • Utilizes high-power, high-stability ultraviolet lasers to directly ablate and vaporize materials, achieving a μm-level heat-affected zone and a minimum processing spot size of 5μm.
  • Achieves high-speed, high-precision etching on small surfaces through precise galvanometer control of beam deflection.
  • Enables large-surface precision machining through high-precision linear motor-driven platform translation.
  • The Z-axis is electrically adjustable to accommodate materials of varying thicknesses, meeting the requirements for etching three-dimensional structures.
  • Expands with A and C axes, suitable for machining irregularly shaped parts.
  • High-resolution industrial cameras are used for full-field error correction of the galvanometer and high-precision focusing, ensuring long-term system stability and accuracy.
  • Supports high-precision positioning and machining of workpieces, with built-in offset compensation functionality.
  • The system employs a marble tabletop to enhance overall stability, with all mechanical components carefully selected to ensure long-term precision.
  • Capable of processing metals, ceramics, organics, glass, and other materials, enabling efficient etching, blind hole drilling, through-hole drilling, slotting, and cutting.
  • Minimum processing line width of 5μm, with a customizable processing range of 300*300mm.

Product Applications

  • Semiconductor flexible circuit board cutting
  • ITO film layer etching
  • Microelectronic device manufacturing
  • Printing template preparation
  • Biochip preparation
  • Precision micro-mold forming

Business Scope

Technical services, technology development, consulting, and promotion. Wholesale and retail of computer software, hardware, and auxiliary equipment. Import and export of technology and goods. Sales of functional glass, new optical materials, optical instruments, specialized semiconductor equipment, experimental analysis instruments, CNC machine tools, and electronic components. Sales of metal cutting and welding equipment, fiber optics, photovoltaic components, and electronic specialized materials.

Product Parameters

Category Parameter FM-UVM20A FM-UVM20B
LaserWavelength355nm355nm
LaserPower20W (3~40W optional)20W (3~40W optional)
LaserModulation Frequency1~200kHz1~200kHz
LaserPulse Width15ns@40kHz15ns@40kHz
LaserBeam Quality M²<1.2<1.2
GalvanometerScan Range<50*50mm<15*15mm
GalvanometerRepeatability<1μm<1μm
GalvanometerPositioning Accuracy≤±3μm≤±3μm
XY StageTravel300*300mm (500*400mm optional)300*300mm (500*400mm optional)
XY StageRepeatability≤±1μm≤±1μm
Z AxisTravel150mm150mm
CCD MonitoringCamera5-megapixel5-megapixel
ProcessingMinimum Spot Size8μm5μm
ProcessingSystem Accuracy±5μm±5μm
CoolingMethodWater-cooledWater-cooled
DimensionsSize1200*1500*1900mm1200*1500*1900mm
WeightTotal Weight1200Kg1200Kg

Note: Achieved after preheating for 30 minutes at a constant temperature of (25±0.5ºC).

Detailed Photos

Frequently Asked Questions

What materials can this ultraviolet laser system process?
The system is highly versatile and can process metals, ceramics, organics, glass, and semiconductor materials for etching, drilling, and cutting.
What is the minimum processing spot size and line width?
The system achieves a minimum processing spot size of 5μm and a minimum processing line width of 5μm, ensuring high precision for micro-machining.
How does the system ensure long-term stability?
It utilizes a marble tabletop for structural stability and incorporates high-resolution industrial cameras for full-field error correction and high-precision focusing.
Can it handle 3D or irregular workpiece shapes?
Yes, the Z-axis is electrically adjustable for 3D structures, and it can be expanded with A and C axes to accommodate irregularly shaped parts.
What is the system's positioning accuracy?
The system offers a positioning accuracy of ≤±3μm for both the galvanometer and the XY stage, with an overall system processing accuracy of ±5μm.
Is the dust extraction system included?
Yes, the system is equipped with a triple dust purification method to ensure a clean processing environment and protect optical components.

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