All-in-One Four-Head Laser Drilling System: Efficiency, Precision, & Automation for High-End Manufacturing

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Product Description

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Basic Information

StructureLaser Drilling Machine
LayoutVertical
Controlling ModeArtificial / Automatic
Number of ShaftMulti-Axis
Hole Diameter<50mm
PrecisionHigh Precision
CertificationCE, RoHS, ISO 9001
Laser Heads4 Heads (Synchronous/Independent)
InnovationIndustry-First 4-Head Synchronous Technology
Efficiency Boost300% Higher Output Than Single-Head
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Product Description

All-in-One Four-Head Laser Drilling System: Efficiency, Precision, & Automation for High-End Manufacturing
Laser Drilling System Overview
Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment - the industry's first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.
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Key Highlights

Synchronous Processing
Optimized Process
Laser Source

4-Head Synchronous Processing

Massive 4X Efficiency Boost: Dramatically increase output and meet tight deadlines for large orders.

Optimized Process (Plasma-Free)

Laser parameters are fine-tuned to eliminate the need for post-drilling plasma treatment. Reduce process steps and simplify your production line.

Picosecond UV Laser Source

Superior Hole Quality: No burrs, cracks, or thermal damage. Perfect for delicate materials like polyimide and glass.

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Precision & Efficiency Comparison

Precision Samples
Quality Assurance
Our Four-Head Laser Drilling Machine delivers exceptional precision with microscopic accuracy. It supports roll-to-roll, roll-to-sheet, and sheet-to-sheet automation for diverse manufacturing needs.
Efficiency Comparison Chart
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Technical Specification

Laser TypeNanosecond UV, Picosecond UV, Picosecond green laser
Processing Area550mm × 1500mm (customizable)
Machine Size7200mm × 2300mm × 2250mm
Accuracy±0.02mm
Power LoadMain Unit + 30kW Chiller + 7kW Exhaust Fan + 11kW
Weight8000KG
EnvironmentTemp: 22℃±2; Humidity: 40% - 60%
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Application Areas

Application Industries
PCB Industry: HDI PCBs, Multi-layer Boards, High-speed through-hole & blind via drilling.
Flexible Circuits: FPC, Flex-Rigid Boards, Polyimide cutting & drilling.
Semiconductor: IC Substrates, Lead Frames, Ultra-fine micro-vias (≤0.05mm).
Consumer Electronics: Smartphones, Wearables, Mass production solutions.
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R&D and Production Capability

Facility
Specializing in the independent research and development of laser generators, optical devices, equipment application processes, and integration of automation systems. We provide innovative solutions for laser micromachining including laser sources and optical systems.
R&D Team 1
R&D Team 2
R&D Team 3
Lab 1
Lab 2
Lab 3
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Packing & Delivery

Packing
Packing: 1PCS/Wooden Case
Shipping Method: By sea or by express. Due to weight, sea freight is recommended for standard orders.
Delivery Time: Standard goods: 30-45 days; Customized goods: 45-90 days after deposit.
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Our Clients

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Frequently Asked Questions

Q1: What is the advantage of 4-head synchronous laser drilling machine?
A: Our 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits (FPC) while significantly reducing cycle time.
Q2: What is the processing accuracy?
A: The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes at high speeds.
Q3: What materials can it process?
A: It is compatible with rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.
Q4: Does it support blind vias and buried vias?
A: Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ) for clean sidewalls.
Q5: Is the system automated?
A: Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.
Q6: Is beam quality consistent across all heads?
A: Our advanced beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality.

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