Small-Format High-Speed Microhole Machining System

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Small-Format High-Speed Microhole Machining System

Customization:	Available
After-sales Service:	One Year Warranty
Warranty:	One Year Warranty

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Product Description

Basic Information

Model NO. AT-61168

Origin China

Package Size 150.00cm * 90.00cm * 150.00cm

Package Gross Weight 2000.000kg

Product Description

The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.

Product Features

Utilizes a high-power, high-stability ultraviolet laser to directly ablate and vaporize materials, resulting in a μm-level heat-affected zone and a minimum processing spot size of 5 μm.
Achieves high-speed, high-precision etching on small formats through precise galvanometer control of beam deflection.
The Z-axis is electrically adjustable to accommodate materials of different thicknesses and meet the requirements for etching three-dimensional structures.
A side-axis high-resolution industrial camera is used for high-precision focusing to ensure machining accuracy and repeatability.
The system employs a marble table top to enhance overall stability, and all mechanical components are carefully selected to ensure long-term precision.
Capable of processing metals, ceramics, organics, glass, and other materials, enabling etching, blind holes, through holes, slotting, and cutting.
Minimum processing line width of 5 μm and a processing range of 50*50 mm.

Product Applications

Electronics Manufacturing: Semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing, printing template preparation, biochip preparation.
Medical Industry: Drug filtration, biosensors, microfluidic chips, CC IT positive sample preparation (pore sizes 1-30 μm).
Precision Machinery: Precision micro-mold forming, micro-nozzle processing, microhole filtration components.
New Energy: Lithium battery separator microhole processing (pore size ≤ 3 μm), hydrogen fuel cell bipolar plate microchannel processing.
Scientific Research: Microstructure research, material science experiments, micro-nano manufacturing technology development.
Other Applications: Carbon fiber micro-cutting, PI micro-masking, silicone microneedle molds.

Product Parameters

Category	Parameter	FM-UV3 Specifications
Laser	Wavelength	355 nm
Laser	Power	> 3W @ 40 kHz (3-40W optional)
Laser	Modulation Frequency	1-200 kHz
Laser	Beam Quality M²	< 1.3
Laser	Power Stability (8h)	< 3%
Galvanometer	Scan Range	< 50*50 mm
Galvanometer	Repeatability	< 1 μm
Galvanometer	Scan Speed	≤ 3.5 m/s
Z-Axis	Travel	200 mm
Z-Axis	Repeatability	≤ ±3 μm
CCD Monitoring	Camera Pixels	5 million
Processing	Minimum Pore Size	5 μm
Processing	Processing Thickness	≤ 0.5 mm
Processing	Accuracy	± 3 μm
Cooling	Method	Water-cooled
Dimensions	Dimensions	750 * 1100 * 1700 mm

Detailed Photos

Frequently Asked Questions

Q1: What materials can the microhole machining system process?

The system is capable of processing a wide range of materials including metals, alloys, ceramics, organics, silicon wafers, and glass.

Q2: What is the minimum processing capability of this system?

The system features a minimum processing line width and pore size of 5 μm, with a processing accuracy of ± 3 μm.

Q3: How does the system maintain stability during high-speed operations?

Stability is enhanced through the use of a professional marble table top and carefully selected mechanical components to ensure long-term precision.

Q4: Can this equipment handle different material thicknesses?

Yes, the Z-axis is electrically adjustable (200 mm travel) to accommodate materials of varying thicknesses and to meet three-dimensional etching requirements.

Q5: What cooling and maintenance features are included?

The system utilizes a water-cooled method for temperature regulation and a triple dust purification system for effective extraction during the machining process.

Q6: What is the maximum depth-to-width ratio achievable?

The system can achieve a maximum depth-to-width ratio of greater than 10:1, making it ideal for precision through-hole and blind-hole applications.