Advanced Microhole Machining System for Precision Engineering Needs

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Advanced Microhole Machining System for Precision Engineering Needs

Customization:	Available
After-sales Service:	One Year Warranty
Warranty:	One Year Warranty

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Product Description

Product Overview

Model NO. AT-61168

Trademark ANTTRANS

Origin China

Package Size 150.00cm * 90.00cm * 150.00cm

Gross Weight 2000.000kg

Product Description

The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.

Key Features

Utilizes a high-power, high-stability ultraviolet laser for μm-level heat-affected zones (minimum processing spot size of 5 μm).
Precise galvanometer control of beam deflection for high-speed, high-precision etching.
Electrically adjustable Z-axis to accommodate different material thicknesses and 3D structures.
High-resolution side-axis industrial camera for high-precision focusing and repeatability.
Stable marble table top design to ensure long-term mechanical precision.
Versatile material compatibility: metals, ceramics, organics, glass, etc.
Minimum processing line width of 5 μm with a 50*50 mm processing range.

Product Applications

Electronics Manufacturing

Semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing, and biochip preparation.

Medical Industry

Drug filtration, biosensors, microfluidic chips, and CC IT positive sample preparation (pore sizes 1-30 μm).

New Energy

Lithium battery separator microhole processing (pore size ≤ 3 μm) and hydrogen fuel cell microchannel processing.

Precision Machinery

Precision micro-mold forming, micro-nozzle processing, and microhole filtration components.

Technical Parameters

Category	Parameter	Specification (FM-UV3)
Laser	Wavelength	355 nm
Laser	Power	> 3W @ 40 kHz (3-40W optional)
Laser	Modulation Frequency	1-200 kHz
Laser	Beam Quality M²	< 1.3
Galvanometer	Scan Range	< 50*50 mm
Galvanometer	Repeatability	< 1 μm
Galvanometer	Scan Speed	≤ 3.5 m/s
Z-Axis	Travel	200 mm
Z-Axis	Positioning Accuracy	≤ ±5 μm
CCD Monitoring	Camera Pixels	5 million
Processing	Minimum Pore Size	5 μm
Processing	Max Depth-to-Width Ratio	> 10:1
Power	Power Supply	220V 50-60Hz 12A
Dimensions	Dimensions	750 * 1100 * 1700 mm

Scope of Service

Focusing on technical services, technology development, and consulting within the precision machinery and optical sectors. Expertise includes the wholesale and retail of specialized software and hardware, sales of functional glass, new optical materials, and CNC machine tools. We provide advanced solutions for semiconductor device equipment, electronic components, and metal cutting and welding technology.

Detailed Photos

Frequently Asked Questions

Q1: What is the minimum hole size the system can process? A1: The system is capable of a minimum pore size of 5 μm, thanks to its high-precision ultraviolet laser technology.

Q2: Which materials are compatible with this laser system? A2: It can process a wide range of materials including metals, alloys, ceramics, silicon wafers, glass, and various organic materials.

Q3: How does the system ensure machining accuracy? A3: The system uses a high-resolution 5-million-pixel industrial camera for focusing and a marble table top to maintain extreme mechanical stability and repeatability (< 1 μm).

Q4: Can this equipment be used for 3D or variable thickness materials? A4: Yes, the Z-axis is electrically adjustable with a 200 mm travel range, making it suitable for etching three-dimensional structures and materials of different thicknesses.

Q5: What are the main applications in the medical field? A5: In the medical industry, it is widely used for preparing drug filtration components, biosensors, microfluidic chips, and precise pore sizes (1-30 μm) for packaging materials like vials.