📋 Basic Specifications
Structure
Laser Drilling Machine
Controlling Mode
Artificial
Number of Shaft
Multi-Axis
Certification
CE, RoHS, ISO 9001
Laser Heads
4 Heads (Synchronous/Independent)
Key Innovation
Industry-First 4-Head Synchronous Technology
🚀 Product Overview
Automated Four-Head Laser Drilling System: Seamless Roll-to-Roll & Sheet Processing for Electronics
Revolutionize your production with unmatched efficiency. This groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment is the industry's first solution designed for high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.
✨ System Highlights
➠ 4-Head Synchronous Processing: Massive 4X Efficiency Boost. Dramatically increase output and meet tight deadlines for large orders.
➠ Optimized Process (Plasma-Free): Laser parameters are fine-tuned to eliminate the need for post-drilling plasma treatment. Reduce process steps and save on consumables.
➠ Picosecond UV Laser Source: Superior Hole Quality with no burrs, cracks, or thermal damage. Perfect for delicate materials like polyimide and glass.
⚙ Technical Specifications
| Parameter |
Details |
| Product Name |
±0.02mm Precision Four-Head Laser Drilling Machine |
| Laser Type |
Nanosecond UV, Picosecond UV, Picosecond green laser |
| Processing Area |
550mm×1500mm (customized) |
| Machine Size |
7200mm×2300mm×2250mm |
| Accuracy |
±0.02mm |
| Machine Weight |
8000KG |
| Environment |
Humidity: 40% - 60%; Temperature: 22℃±2 |
🏭 Expertise & Development
Founded in 2013, we are a technology-oriented enterprise specializing in the independent research and development of laser generators, optical devices, and automation system integration. We provide innovative solutions for laser micromachining applications, including processing technology, laser sources, and technical support. We create value for clients in industries such as printed circuit boards, consumer electronics, semiconductors, glass, and new energy.
📱 Application Areas
PCB Industry: HDI PCBs, Multi-layer Boards, High-speed through-hole & blind via drilling.
Flexible Circuits: FPC, Flex-Rigid Boards, Polyimide cutting & drilling.
Semiconductor: IC Substrates, Lead Frames, Ultra-fine micro-vias (≤0.05mm).
Consumer Electronics: Smartphones, Wearables, Mass production solutions.
📦 Packing & Delivery
Packing: 1PCS/Wooden Case
Shipping: By sea or by express. Due to weight, sea shipping is recommended.
Delivery Time: Standard goods: 30-45 days; Customized goods: 45-90 days after order confirmation.
❓ Frequently Asked Questions
Q1: What is the advantage of the 4-head synchronous laser drilling machine?
A: Our 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits (FPC) while significantly reducing cycle time.
Q2: What is the drilling accuracy?
A: The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes at high speeds.
Q3: What materials can it process?
A: It is compatible with rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.
Q4: Does it support blind vias and buried vias?
A: Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ) for clean sidewalls.
Q5: Is the system automated?
A: Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.
Q6: Is beam quality consistent across all four heads?
A: Our beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality across the entire processing area.
🤝 Trust by Industry Leaders
Focus Laser
