• Utilizes high-power, high-stability ultraviolet lasers to directly ablate and vaporize materials, achieving a μm-level heat-affected zone and a minimum processing spot size of 5μm.
• Achieves high-speed, high-precision etching on small surfaces through precise galvanometer control of beam deflection.
• Enables large-surface precision machining through high-precision linear motor-driven platform translation.
• The Z-axis is electrically adjustable to accommodate materials of varying thicknesses, meeting the requirements for etching three-dimensional structures.
• Expands with A and C axes, suitable for machining irregularly shaped parts.
• High-resolution industrial cameras are used for full-field error correction of the galvanometer and high-precision focusing, ensuring long-term system stability and accuracy.
• Supports high-precision positioning and machining of workpieces, with built-in offset compensation functionality.
• The system employs a marble tabletop to enhance overall stability, with all mechanical components carefully selected to ensure long-term precision.
• Capable of processing metals, ceramics, organics, glass, and other materials, enabling efficient etching, blind hole drilling, through-hole drilling, slotting, and cutting.
• Minimum processing line width of 5μm, with a customizable processing range of 300*300mm.

We focus on technical services, technology development, and consulting across various sectors including computer hardware and auxiliary equipment, functional glass, and new optical materials. Our expertise extends to optical instruments, specialized equipment for semiconductor devices, CNC machine tools, and electronic components. We provide comprehensive solutions for metal cutting, welding equipment, and photovoltaic components, ensuring high-quality industrial standards and innovation.

*Note: Achieved after preheating for 30 minutes at a constant temperature of (25±0.5ºC).