Nanosecond Laser Cutting Machine (UV/IR/Green Light)

Our Nanosecond laser cutting machines are specifically designed for industries such as electronics, semiconductors, and new energy. With high precision, high stability, and wide material adaptability, they are particularly suitable for efficient and precise cutting of brittle and thin materials.

Equipment Advantages

• High Efficiency: Excellent processing speed and operational stability.
• Precise Control: Advanced laser energy control leaving minimal Heat Affected Zone (HAZ).
• Ultra High Precision: Processing accuracy of ±5 micrometer, ideal for miniaturized components.
• Flexible Production: Non-contact processing prevents material deformation and mechanical stress.

Key Configurations

1. Features a marble platform X/Y system driven by linear motors, ensuring precision and stability with low maintenance costs.
2. Configured with a high-pixel CCD automatic alignment function to guarantee precise product cutting alignment.
3. Optional extra-large field telecentric lens supports a maximum single processing area of 200×200mm.

• National high-tech enterprise, owning 150 national patents.
• 80,000 square meters of production factories with multiple R&D bases.
• ISO9001: 2015 international quality management system standard compliant.
• Equipped with dozens of advanced laser processing systems for continuous innovation.