Focus Laser
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| Model NO. | CS-0605-V-A | Cooling System | Water Cooling |
| Technical Class | Pulse Laser | Applicable Material | Nonmetal |
| Structure Type | Gantry Type | Laser Classification | Solid Laser |
| Laser Technology | Laser Flame Cutting | Laser Type | Ultrafast Laser |
| Laser Power | 10W/30W/35W | Working Area | 500*610mm |
| Positioning Accuracy | ±1um | Processing Speed | ≤3000mm/S |
| Processing Accuracy | ≤30um | Focus Spot | ≤20um |
| Certification | CE | Processing Thickness | 3mm |
| Processing Material | Pi Film, Cover Film, FPC, PCB, etc. | Power Supply | AC 380V±10%, 50~60Hz |
Picosecond Laser Cutting Machine (UV/IR/Green Light)
We provide comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision cutting, ultra-thin PCB cutting, high-resolution marking, plating removal, metal deep engraving, and micro-hole machining. Compared to traditional processing techniques, our laser solution offers groundbreaking advantages: processing accuracy of ±5 micrometers, satisfying miniaturization requirements; non-contact processing that poses zero damage to the product; and flexible production without the need for molds, significantly reducing costs.
Equipment Advantages
Application Fields
Widely deployed in mobile, communication, consumer electronics, semiconductors, and biomedical sectors. Suitable for precision cutting, drilling, and etching on flexible OLED, LCP, PI film, FPC, nanogold, polarizer, and cover films.
1. Comprehensive technical support, including remote video guidance and professional telephone consultation.
2. Long-term and stable supply of genuine parts and high-quality consumables to ensure optimal operating conditions.
3. One-year warranty and lifetime technical service for all laser equipment.
