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| Category | Parameter | FM-LPCD150/300 |
|---|---|---|
| Laser | Wavelength | 1070±10nm |
| Power | 150W/300W | |
| Modulation frequency | 1~100kHz | |
| Beam quality M2 | <1.3 | |
| Power stability (8h) | <3% | |
| XY Workbench | Journey | 600*600mm |
| Repeatability | ≤±0.002mm | |
| Positioning accuracy | ≤±0.01mm | |
| Acceleration | ≤1G | |
| Speed | ≤800mm/s | |
| Z-axis | Journey | 150mm |
| Repeatability | ≤±3μm | |
| Positioning accuracy | ≤±5μm | |
| Visual Positioning | Accuracy | ±0.01mm |
| Processing Capacity | Minimum kerf (aperture) | 0.05mm |
| Processing thickness | ≤5mm | |
| Machining accuracy | ≤±0.01mm (plate <1mm) | |
| Repeatability | ≤±0.003mm (plate <1mm) | |
| Max aspect ratio | >30:1 | |
| Materials | Metals, alloys, ceramics | |
| Cutting Assist Gas | High-pressure air, N2, O2 | |
| Cooling System | Water cooling | |
| Electricity | 380V 50~60Hz 15A | |
| Power consumption | ≤5kW | |
| Size | 1500*1600*1900mm | |
| Weight | 1200Kg | |






Our factory is a technology-driven enterprise specializing in the R&D, production, and sales of industrial and scientific research laser application systems. We provide customers with precision laser application solutions for micro-hole, micro-groove, micro-welding, scribing, cutting, marking, and feature forming, with feature processing linewidths ranging from 1 to 500 μm.
Successfully developed systems include Femtosecond Laser Precision Processing, Picosecond Laser Ultra-Fine Processing, Laser Micromachining, Roll-to-Roll Thin Film Micro-Hole Processing, and more, serving industries like biomedicine, semiconductors, and new energy.