Laser Micro-Machining System/Micro-Machining Laser/Laser System

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Laser Micro-Machining System/Micro-Machining Laser/Laser System

Customization:	Available
After-sales Service:	One Year Warranty
Warranty:	One Year Warranty

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Product Description

📋 Overview & Basic Info

Model NO. AT-61157

Origin China

Package Size 50.00cm * 60.00cm * 50.00cm

Gross Weight 30.000kg

⚡ Key Features

🔥

High-power, high-stability ultraviolet lasers for direct ablation and vaporization, achieving μm-level heat-affected zones.

🎯

Precise galvanometer control for high-speed etching on small surfaces (minimum processing spot size of 5μm).

➡

High-precision linear motor-driven platform for large-surface translation and precision machining.

↕

Electrically adjustable Z-axis to accommodate varying material thicknesses and 3D structures.

📷

High-resolution industrial cameras for full-field error correction and high-precision focusing.

💎

Stable marble tabletop system ensures long-term accuracy and vibration resistance.

💻 Product Applications

Semiconductor flexible circuit board cutting ITO film layer etching Microelectronic device manufacturing Printing template preparation Biochip preparation Precision micro-mold forming

⚙ Technical Parameters

Category	Parameter	FM-UVM20A	FM-UVM20B
Laser	Wavelength	355nm	355nm
Laser	Power	20W (3~40W optional)	20W (3~40W optional)
Laser	Modulation Frequency	1~200kHz	1~200kHz
Laser	Pulse Width	15ns@40kHz	15ns@40kHz
Laser	Beam Quality M²	<1.2	<1.2
Galvanometer	Scan Range	<50*50mm	<15*15mm
Galvanometer	Positioning Accuracy	≤±3μm	≤±3μm
XY Stage	Travel	300*300mm	300*300mm
XY Stage	Repeatability	≤±1μm	≤±1μm
Z Axis	Travel	150mm	150mm
Processing	Minimum Spot Size	8μm	5μm
Processing	3D Etching	Supported	Supported
Processing	System Accuracy	±5μm	±5μm
Cooling	Method	Water-cooled	Water-cooled

* Note: Parameters achieved after preheating for 30 minutes at a constant temperature of (25±0.5ºC).

🌐 Capabilities & Business Scope

Our specialized focus includes technical development and consulting for computer software/hardware, retail and wholesale of experimental analysis instruments, and CNC machine tools. We excel in the sales of specialized equipment for semiconductor devices, optical glass, functional glass, and new optical materials, providing comprehensive solutions for metal cutting and welding equipment.

📸 Detailed Gallery

❓ Frequently Asked Questions

Q1: Which materials can this laser system process?

The system is highly versatile and capable of processing metals, ceramics, organic materials, glass, and more, enabling efficient etching, drilling, slotting, and cutting.

Q2: What is the minimum processing precision?

The system achieves a minimum processing line width of 5μm and a minimum spot size down to 5μm (model dependent), with a system accuracy of ±5μm.

Q3: Does the machine support 3D structure processing?

Yes, the Z-axis is electrically adjustable to handle materials of varying thicknesses, specifically meeting the requirements for etching three-dimensional structures.

Q4: How does the system maintain long-term stability?

The equipment employs a solid marble tabletop to enhance overall stability, paired with high-resolution industrial cameras for continuous error correction and focusing.

Q5: What are the cooling and power requirements?

The system utilizes water-cooling and requires a 220V 50~60Hz power supply with a maximum power consumption of ≤2000W.

Q6: Is it suitable for semiconductor applications?

Absolutely. It is specifically designed for semiconductor flexible circuit board cutting, ITO film etching, and microelectronic device manufacturing.