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Home > High-Speed Industrial Laser Micro-Processing Platforms > Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
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Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving
Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving

Factory Nanosecond Laser Cutting Machine for LCD Panel Engraving

Customization: Available
Warranty: 12 Months
Application: Aerospace Industry, Automotive Industry, Semiconductors/3c
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Product Description

Technical Overview

Model NO.
CW-6050FZ/PZ/Z
Cooling System
Water Cooling
Technical Class
Pulse Laser
Applicable Material
Nonmetal
Structure Type
Gantry Type
Laser Classification
Solid Laser
Laser Technology
Laser Flame Cutting
Laser Type
Ultrafast Laser
Laser Power
10W/30W/35W
Working Area
500*610mm
Positioning Accuracy
±1um
Processing Speed
≤3000mm/S

Nanosecond Laser Cutting Machine

Our Nanosecond laser cutting machines (UV/IR/Green Light) are engineered for high precision and stability. Specifically designed for electronics, semiconductors, and new energy sectors, they excel in processing brittle and thin materials with minimal heat impact.

Equipment Advantages

01
High Efficiency: Superior processing stability and speed for industrial demands.
02
Minimal HAZ: Precise energy control ensures a minimal Heat Affected Zone.
03
Ultra Precision: Achieves ±5 micrometer processing accuracy for micro-components.
04
Non-Contact: Zero mechanical stress or deformation during the cutting process.
Nanosecond Laser Cutting Machine

Working Demonstration

Video Cover

Key Configurations

  • Linear Motor System: Marble platform X/Y system driven by linear motors for high-speed precision and low maintenance.
  • CCD Alignment: High-pixel CCD automatic alignment for complex irregular patterns and micro-sized cuts.
  • Telecentric Lens: Optional large field lens supporting up to 200×200mm processing without stitching.
Laser Processing Example 1
Laser Processing Example 2
Laser Processing Example 3

Technical Specifications

Laser Power10W/30W/35W Dimensions2200*1500*1750mm
Working Area500*610mm CertificationCE
Positioning Accuracy±1um Machinery Test ReportProvided
Processing Speed≤3000mm/s Video InspectionProvided
Processing Accuracy≤30um Warranty12 Months

Our Capabilities & R&D

Operating since 2012, we are a national high-tech enterprise with over 150 patents. Our production facility spans 80,000 square meters, supporting global industrial customers with high-quality laser engraving and cutting solutions.

Production Factory
R&D Center

Packaging & Shipping

All machines are packed in standard export wooden cases to ensure maximum protection during international transit.

Shipping Package 1
Shipping Package 2
Shipping Package 3

Frequently Asked Questions

What materials can this machine process?
The nanosecond laser is ideal for non-metal materials including FPC, PCB, camera modules, ceramics, tungsten steel, PI, polymer materials, and various foils.
Are you a manufacturer or a trade company?
We are a direct manufacturer with independent R&D and large-scale manufacturing capabilities across multiple production bases.
What is the typical delivery timeline?
Standard equipment typically requires approximately 35 days for manufacturing and testing following the receipt of payment.
What kind of after-sales service is provided?
We provide a one-year warranty and lifetime technical support. This includes remote video guidance, genuine parts supply, and professional consultations.
How accurate is the laser positioning?
The system achieves a positioning accuracy of ±1um and a repeatability of 1um, making it suitable for high-precision micro-cutting in the semiconductor and 3C industries.
Can you provide customized solutions?
Yes, we offer professional technical solutions and machine customizations based on specific material processing requirements and production workflows.

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