Focus Laser
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| Model NO. | CW-6050FZ/PZ/Z |
| Cooling System | Water Cooling |
| Technical Class | Pulse Laser |
| Applicable Material | Nonmetal |
| Structure Type | Gantry Type |
| Laser Classification | Solid Laser |
| Laser Technology | Laser Flame Cutting |
| Laser Type | Ultrafast Laser |
| Laser Power | 30W |
| Working Area | 500*610mm |
| Positioning Accuracy | 1um |
| Processing Speed | ≤3000mm/S |
| Processing Accuracy | ≤30um |
| Focus Spot | ≤20um |
| Certification | CE |
| Processing Material | FPC, PCB, Camera Modules, etc. |
| Power Supply | AC 380V+10%, 50~60Hz |
| Specification | 2200*1500*1750mm |
Our Nanosecond laser cutting machines, with core advantages of high precision, high stability, and wide material adaptability, are specifically designed for industries such as electronics, semiconductors, and new energy. They are particularly suitable for efficient and precise cutting of brittle and thin materials.
1. Features a marble platform X/Y system driven by linear motors, ensuring precision and stability during high-speed operation.
2. Configured with a high-pixel CCD automatic alignment function to guarantee precise product cutting alignment.
3. Optional extra-large field telecentric lens supports a maximum single processing area of 200×200mm.
| Laser Power | 30W | Dimensions | 2200*1500*1750mm |
| Working Area | 500*610mm | Certification | CE |
| Positioning Accuracy | 1um | Machinery Test Report | Provided |
| Processing Speed | ≤3000mm/s | Video Inspection | Provided |
| Processing Accuracy | ≤30um | Warranty | 12 Months |
| Focus Spot | ≤20um | Core Components | Semiconductor Pump Source |
We provide comprehensive technical support, including remote video guidance, professional consultation, and a 24-hour response system.
Stable performance, high-precision processing, and cost-effective production with low maintenance requirements.
