Precision Microhole Machining System for Efficient Production Processes

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

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Overview
Model NO. AT-61168
Origin China
Package Size 150.00cm * 90.00cm * 150.00cm
Gross Weight 2000.000kg
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Product Description
The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.
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Product Features
  • High-power ultraviolet laser for direct ablation, resulting in a μm-level heat-affected zone.
  • Precise galvanometer control for high-speed, high-precision etching.
  • Electrically adjustable Z-axis for various material thicknesses and 3D structures.
  • High-resolution side-axis industrial camera for high-precision focusing.
  • Marble table top construction to enhance overall stability and long-term precision.
  • Versatile processing for metals, ceramics, organics, glass, and more.
  • Minimum processing line width of 5 μm with a 50*50 mm range.
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Product Applications
Electronics Manufacturing
Semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing.
Medical Industry
Drug filtration, biosensors, microfluidic chips, CC IT positive sample preparation (1-30 μm pore sizes).
New Energy
Lithium battery separator microhole processing (pore size ≤ 3 μm), hydrogen fuel cell microchannel processing.
Precision Machinery
Precision micro-mold forming, micro-nozzle processing, microhole filtration components.
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Product Parameters
Category Parameter FM-UV3 Specifications
LaserWavelength355 nm
LaserPower> 3W @ 40 kHz (3-40W optional)
LaserModulation Frequency1-200 kHz
LaserPower Stability (8h)< 3%
GalvanometerScan Range< 50*50 mm
GalvanometerRepeatability< 1 μm
GalvanometerScan Speed≤ 3.5 m/s
Z-AxisRepeatability≤ ±3 μm
MonitoringCamera Pixels5 million
CapabilityMinimum Pore Size5 μm
CapabilityProcessing Thickness≤ 0.5 mm
CapabilityMaterialsSilicon, Metals, Alloys, Ceramics
DimensionsMachine Size750 * 1100 * 1700 mm
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Detailed Photos
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Frequently Asked Questions
What materials is this microhole machining system suitable for?
The system is highly versatile and capable of processing metals, alloys, ceramics, organics, glass, and silicon wafers.
What is the minimum hole size achievable?
The system can achieve a minimum processing spot size and pore size of 5 μm, with a high degree of precision.
How does the system maintain machining accuracy?
It utilizes a high-stability ultraviolet laser, precise galvanometer control, a marble stable platform, and a high-resolution industrial camera for high-precision focusing.
Can it process thick materials?
It is optimized for precision micro-machining with a recommended processing thickness of ≤ 0.5 mm for optimal results.
What cooling method is required for the UV laser?
The system utilizes a water-cooling method to ensure the laser operates at a stable temperature for consistent power output.
Does the system provide dust protection?
Yes, the system is equipped with a triple dust purification extraction method to maintain a clean working environment.

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