Precision UV Laser Marking System for Automotive PCBA Quality Inspection

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Precision UV Laser Marking System for Automotive PCBA Quality Inspection

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

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Product Description

Basic Information

Product Name:

PCBA & IC & Wafer Marking Machine

Laser Wavelength:

UV Laser, CO2 Laser

Applicable Material:

Metal, PCB, FPC

Cooling System:

Air Cooling

Laser Visibility:

Visible

Technical Class:

Continuous Wave Laser

Marking Method:

Scanning Marking

Type:

YAG Laser Marking Machine

Origin:

China

Product Description

Brief Description:

Applicable for digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC, and more. Highly efficient marking on rigid and flexible printed circuit boards (PCBAs). Supports 1D barcodes, 2D Matrix, QR codes, logos, and batch number marking.

Key Features

Fully-automatic loading and unloading from hanging basket, stable laser output, intelligent vision system for direction inspection and sampling inspection.

Friendly Human-Machine Interface (HMI) for easy operation and monitoring.

Equipped with 20W fiber laser marking system; optional green laser, UV laser, and CO2 laser sources available.

Special fume removal device to quickly extract dust and fumes, protecting the marking environment.

Complies with CE MARK and SEMI standards for global safety and quality requirements.

Technical Specifications

Machine model	HDZ-SIC100	HDZ-SIC200
Marking scope	320mm*160mm	320mm*160mm
Product specification	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font	TFT and SHX; with font library module modification program
Positioning precision	±0.1mm	±0.1mm
UPH (Units Per Hour)	1200 pieces/h (idle)	1200 pieces/h (idle)
Power supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Air source	0.6-0.8 MPa	0.6-0.8 MPa
Overall dimension	252516652000mm	251514202000mm

Industry Applications

Main product scope includes: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, Laser Annealing, and Automatic Dicing Saw Machines for wafer packaging.

Packaging & Shipping

Frequently Asked Questions

Q1: How to choose a suitable machine? A1: You can provide the working piece material, size, and your functional requirements. Based on our industry experience, we will recommend the most cost-effective solution.

Q2: What is the warranty period for the equipment? A2: We offer a one-year warranty and provide 24-hour online professional technical support to ensure your production remains uninterrupted.

Q3: Can the laser source be customized? A3: Yes, we offer optional laser sources including Fiber, UV, Green, and CO2 lasers to suit different material processing needs.

Q4: What is the lead time for equipment delivery? A4: Typical lead time ranges from 15 to 30 days depending on the specific customization and machine model.

Q5: Do you provide training for operators? A5: Yes, we provide comprehensive operation manuals and remote video training. On-site training can also be arranged if necessary.

Q6: Are the machines compliant with international standards? A6: All our marking machines comply with CE MARK and SEMI standards, ensuring high safety and reliability in industrial environments.