Picosecond Laser Cutting Machine (UV/IR/Green Light)

We provide comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision cutting, ultra-thin PCB cutting, high-resolution marking, plating removal, metal deep engraving, and micro-hole machining. Our laser solution comes with groundbreaking advantages: processing accuracy of ±5 micrometer, satisfying the miniaturization requirement of electronic components; non-contact processing that poses zero damage to the product; and flexible production without any need for molds.

1. Features a marble platform X/Y system driven by linear motors, ensuring precision and stability during high-speed operation with low maintenance costs.

2. Configured with a high-pixel CCD automatic alignment function to enable processing of micro-sized cuts and complex patterns.

3. Optional extra-large field telecentric lens supports a maximum single processing area of 200×200mm without stitching.

As a national high-tech enterprise with over 150 national patents, we operate 80,000 square meters of production facilities. Our equipment is utilized across various sectors including mobile, communication, consumer electronics, and semiconductors. We adhere strictly to ISO9001:2015 standards to ensure superior quality and stability.

Service Commitment: We provide full-process digitalization of after-sales service, including remote video guidance, professional telephone consultation, and a long-term supply of genuine parts to ensure optimal equipment condition.