Auto-Scan-Laser Video Measuring System for PCB Board
High Precision UTG Laser Cutting Machine for Optimal Glass Performance
Large CNC Cutting Machine for Precision Special-Shaped Edge Grinding
Smartphone Barometer Sapphire Glass Window Optical Lens
Versatile Use Fully Automatic Laser Panel Cutting Machine
High-Efficiency Schutten 580W 630W Solar Panel Energy System
Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
Custom Metal Processing Solutions for Shaft Shredder
The global demand for High-Density Interconnect (HDI) PCBs is skyrocketing, driven by the relentless miniaturization of consumer electronics, the roll-out of 5G infrastructure, and the expansion of the IoT ecosystem. HDI via drilling systems have become the backbone of modern electronics manufacturing, allowing for more components to be packed into smaller areas while maintaining high signal integrity.
Technological progression is shifting from mechanical drilling to ultra-precision Laser Via Drilling (LVD). The industry is seeing a transition towards CO2 and UV laser hybrid systems, which offer the ability to drill micro-vias through copper and dielectric materials with zero mechanical stress. Trends focus on higher pulse frequencies, smaller spot sizes (down to 10-20 microns), and AI-driven predictive maintenance.
Global procurement managers are no longer just looking for machines; they are seeking Total Process Solutions. Key requirements include high throughput (holes per second), sub-micron accuracy, multi-layer registration capabilities, and robust localized technical support to minimize downtime in 24/7 production environments.
Hangzhou Focus Laser Co., Ltd. is a professional manufacturer specializing in advanced laser processing equipment for the electronics and display industries. The company focuses on the development and production of PCB laser cutting machines and glass laser cutting systems, delivering high-precision solutions for micro-electronics manufacturing and optical material processing.
Its technologies are widely applied in PCB depaneling, flexible circuit board processing, semiconductor packaging, and precision glass cutting for smartphones, display panels, and optical components. By integrating fiber laser technology, ultra-fine beam control, and intelligent CNC systems, Hangzhou Focus Laser ensures high cutting accuracy, smooth edges, and minimal thermal damage during processing.
The company’s equipment is extensively used in industries such as consumer electronics, semiconductor manufacturing, automotive electronics, and smart display production. It supports both high-volume industrial production and customized precision machining requirements.
As a leading Chinese factory, we leverage the world's most comprehensive electronics supply chain. This allows us to integrate the highest quality components—from ultra-stable granite bases to world-class laser sources—at a fraction of the cost of European or Japanese counterparts.
Hangzhou Focus Laser emphasizes innovation and engineering excellence. We provide robust OEM and ODM services, tailoring the laser parameters and automation software to meet specific substrate materials (FR4, PTFE, Ceramic) and production volumes.
Strict quality control standards are applied at every stage of assembly. Our systems undergo 72-hour continuous stress tests and precision verification using high-end interferometers to ensure every machine meets international export standards.
Precision micro-via drilling for smartphone motherboards (Any-Layer HDI), allowing for high-density component placement and slim device designs.
Manufacturing highly reliable PCBs for EV battery management systems (BMS) and advanced driver-assistance systems (ADAS) where thermal management is critical.
Laser drilling for IC substrates and SiP (System-in-Package) modules, enabling the next generation of high-performance computing chips.
Years Industry Experience
Global Installations
Drilling Precision
Technical Support
Hangzhou Focus Laser Co., Ltd. aims to become a leading global supplier of precision laser solutions for PCB, glass, and advanced electronic manufacturing applications. Continuously advancing laser micro-processing technology, we ensure our partners stay ahead in the competitive global market.
100W-350W Galvo Laser Engraving System
High Output 30W Laser Splitting Machine
High-Precision Fully Automatic Glass Cutting System
Super Thin Wire Vimfun S G20 Advanced Equipment
Vision Guided Laser Marking System for Electronics
Femtosecond Laser Tgv Etching Machine for Glass
Advanced Technology High-Power Fiber Laser Cutting System
Inte Fully Automatic Laser Panel Cutting Machine
Focus Laser