Hangzhou Focus Laser Co., Ltd. is a professional manufacturer specializing in advanced laser processing equipment for the electronics and display industries. The company focuses on the development and production of PCB laser cutting machines and glass laser cutting systems, delivering high-precision solutions for micro-electronics manufacturing and optical material processing.
Its technologies are widely applied in PCB depaneling, flexible circuit board processing, semiconductor packaging, and precision glass cutting for smartphones, display panels, and optical components. By integrating fiber laser technology, ultra-fine beam control, and intelligent CNC systems, Hangzhou Focus Laser ensures high cutting accuracy, smooth edges, and minimal thermal damage during processing.
The company’s equipment is extensively used in industries such as consumer electronics, semiconductor manufacturing, automotive electronics, and smart display production. It supports both high-volume industrial production and customized precision machining requirements. With strong R&D capabilities and strict quality control standards, we provide OEM and ODM services to meet global customer needs.
The global semiconductor industry is undergoing a paradigm shift towards miniaturization and 3D packaging. As chips become smaller and more complex, traditional mechanical sawing and etching are being replaced by ultra-fast laser machining. The demand for high-yield, low-damage processing of silicon, SiC (Silicon Carbide), and GaN (Gallium Nitride) is at an all-time high.
The transition from nanosecond to picosecond and femtosecond lasers is the defining trend of 2024-2025. "Cold processing" minimizes the heat-affected zone (HAZ), which is critical for the next generation of AI-powered chipsets and foldable OLED displays. Integration with AI-driven vision systems for real-time error correction is now a standard requirement.
International buyers from Europe, North America, and Southeast Asia are increasingly seeking OEM/ODM partners who can provide integrated solutions. The focus has shifted from just "buying a machine" to "securing a stable manufacturing process" that includes automation, data traceability, and long-term reliability.
Laser machining solutions are not one-size-fits-all. Different regions and industries require specific configurations:
In hubs like Vietnam and South China, our UV Picosecond cutting machines are essential for FPC (Flexible Printed Circuit) and COB substrate processing, ensuring the slim profile of modern smartphones.
With the rise of EVs, laser marking and dicing for LiDAR sensors and power modules require extreme durability and precision, which our enclosed fiber systems provide.
The manufacturing of stents and surgical tools often requires the multi-head laser drilling technology we've developed for high-speed, burr-free finishing.
For high-end AR/VR lenses and smartwatch covers, our Stealth Dicing and Splitting integrated machines offer a perfect finish that traditional methods cannot match.
Choosing Hangzhou Focus Laser as your OEM/ODM partner provides several strategic advantages:
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