High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor

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High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor

Customization:	Available
After-sales Service:	7*24 Hours
Warranty:	12 Months

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Product Description

Basic Information

Model NO.

WDM-01

Application

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Metal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

OEM

Yes

Flatness of Cutter Face

≤0.002mm

Reach Accuracy

+0.003mm

Minimum Measurement

0.5*0.5mm

Cutting Substrate

Si, Pkg, PCB etc

Spindle Output Power

1.8kw(2.4kw)

Spindle Speed Range

6000-60000rpm

Origin

China

Product Description

⚙️

Precision Wafer Dicing Machine
The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, light-emitting diodes (LEDs), LED chips, solar cells, and electronic substrates.

Working Principle: The machine operates by utilizing an aerostatic spindle to drive a diamond grinding wheel cutting tool at high rotational speeds. This enables precise cutting or grooving of wafers and devices along predetermined dicing streets.

Specifications & Components

📊Indicator: Displays spindle speed and cutting depth.

🔘Control Button: User interface for workflow management.

🧠Control System: Central unit for motion and safety regulation.

💡Lighting: Integrated illumination for monitoring alignment.

📍Working Table: Precision platform with vacuum suction.

Axis / Component	Parameter	Range / Value
X Axis	Feed Speed Range	310mm / 0.1-1000mm/s
Y Axis	Single Step Increment	0.0001mm
Y Axis	Reach Accuracy	0.003mm/310mm
Z Axis	Repetition Accuracy	0.001mm
T Axis	Max Rotation Angle	380°
Spindle	Speed Range	6000-60000rpm
Spindle	Output Power	1.8KW (2.4KW)
Power	Voltage Source	AC380V±10%

Application & Materials

Industry Applications:

IC (Integrated Circuits)
QFN/DFN Packaging
LED Substrates
Optical Communication
Photovoltaic Industry

Processable Materials:

Silicon Wafers
Ceramics & Alumina (Al2O3)
Glass & Quartz
PCBs
Lithium Niobate (LiNbO3)

Packing & Delivery

📦Packaging: IPPC Certified Wooden Crates with shock-absorbent cushioning and weatherproof sealing.

✈️Freight Options: Air Freight (Urgent), Sea Freight, and Railway Freight alternatives.

Professional Manufacturing

Specializing in high-performance, cost-effective semiconductor manufacturing solutions, our equipment serves a global client base across 30+ countries. We focus on delivering value through cost efficiency, secure transaction integration, and reliable technical support.

Frequently Asked Questions

❓ What is the cutting accuracy of modern wafer dicing machines?

Advanced machines typically achieve cutting accuracies of ±1-5μm, with high-end models reaching sub-micron precision. This depends on spindle technology and vibration control.

❓ What's the difference between blade dicing and laser dicing?

Blade dicing uses diamond blades for mechanical cutting (cost-effective for silicon), while laser dicing uses focused beams (better for brittle or thin materials).

❓ How do I choose the right dicing blade?

Selection depends on material hardness (resin-bonded for silicon, metal-bonded for ceramics), wafer thickness, and required edge quality.

❓ What maintenance is required?

Daily blade inspection, weekly lubrication, monthly guide calibration, and annual system recalibration are essential for longevity and precision.

❓ What materials are compatible with this equipment?

It is compatible with Silicon, Quartz, Alumina, Glass, Ceramics, Lithium Niobate, and various PCB substrates.

❓ What cooling system does the WDM-01 use?

This model utilizes an Air Cooling system to maintain optimal operating temperatures for the semiconductor laser and components.