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| Machine Model | EP-15/25/30-THG-D |
| Laser Wavelength | 355nm |
| Laser Power | 4W / 7W / 10W / 15W / 25W |
| Min. Marking Line Width | 10µm - 15µm |
| Marking Speed | 250 characters/sec |
| Marking Scope | 100*100mm |
| Pulse Frequency | 10-200kHz |
| Cooling Mode | Water Cooling |
| Power Supply | AC 220V, 50Hz, 16A |
| Overall Dimension | 800mm * 1025mm * 1500mm |
Our equipment is exported to over 30 countries, serving over 200 customers and suppliers worldwide. We specialize in semiconductor industry equipment integration, ensuring cost-effective solutions and risk avoidance.
Main Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, Laser Annealing, and Automatic Dicing Saw Machines.

