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| Machine Model | EP-15/25/30-THG-S |
| Laser Wavelength | 355nm |
| Laser Power | 4W / 7W / 10W / 15W / 25W |
| Min. Marking Line Width | 10µm - 15µm |
| Marking Speed | 250 characters/sec |
| Marking Scope | 100*100mm |
| Standard Lens | F160 |
| Pulse Repetition Frequency | 10-200kHz |
| Cooling Mode | Water cooling |
| Power Supply | AC 220V, 50Hz, 16A |
| Total Power Consumption | ≤1.5kW |
| Overall Dimension | 800mm*950mm*1630mm |
Mainly engaged in international trade and integration of semiconductor industry equipment, products are exported to over 30 countries with over 200 global customers and suppliers. We aim to provide cost-effective solutions including Die Bonders, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, and Automatic Dicing Saw Machines.
Equipment is secured in customized or wooden box packaging to ensure safety during international transit.