Advanced Glue Dispensing System for FPC Package Applications

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Advanced Glue Dispensing System for FPC Package Applications

Customization:	Available
After-sales Service:	Provided
Precision:	High Precision

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Product Description

📋 Basic Information

Model NO.

DK-04

Condition

New

Certification

ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Working Area

X: 260mm, Y: 260mm, Z: 100mm

Max. Moving Speed

800 mm/S

Repeatability

+/- 0.025 mm

🚀 Product Description

Standard Features

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
CE certified

Optional Features

Automatic constant temperature system; Laser Height Detection for automatic Z-axis calibration.

💡 Key Features & Advantages

Ultra-Precise Dispensing

Repeatability: ±0.025mm, ideal for micro-dots, underfill, and die-attach adhesives. Max Speed: 800mm/s.

Smart CCD Vision

Automated Pattern Recognition compensates for substrate misalignment with real-time inspection.

Semiconductor-Grade

Industrial PC + High-Speed Motion Control. Supports SECS/GEM Protocol for smart factory integration.

Cleanroom Compatible

Anti-Static design (ESD protection) and vacuum nozzle cleaning. Suitable for ISO Class 5-8 cleanrooms.

📊 Product Parameters

Applicable for LENS dispensing, FPC package, SMT red glue, solder paste, LED package, and fingerprint identification modules.

Specifications	TSV-300	HSV-300
Dimension (mm)	L810×W660×H760	L900×W650×H1460
Weight (kg)	105	190
Control	Industrial PC + motion control card
Software	Anda control software + Windows system
Programming	Visual programming
Working area (mm)	X:260 ; Y:260 ; Z:100
Max. Moving speed	800 mm/s
Repeatability	± 0.025 mm
Power supply	220V 50/60Hz

🎯 Key Applications

Flip-Chip Underfill Dispensing
Die Attach Adhesive Application
Wafer-Level Packaging (WLP)
Advanced PCB Assembly (SiP, Fan-Out)
MEMS & Sensor Packaging
LED & Fingerprint Modules

🌍 Exhibition & Customers

Our equipment is currently exported to over 30 countries, serving over 200 customers and suppliers worldwide. We specialize in semiconductor industry equipment integration, including Die Bonders, Wire Bonding, and Laser Marking systems.

📦 Packaging & Shipping

Secure Packaging: Protected with shock-absorbing bubble foam inside a robust wooden crate for maximum transit safety.

Global Logistics: Reliable shipping via road, sea, and air freight to meet your timeline and budget needs.

❓ Frequently Asked Questions

How to choose a suitable machine?

You can specify the workpiece material, dimensions, and required functions. Our experts will recommend the most suitable configuration based on your production needs.

What is the warranty period and technical support?

We provide a one-year warranty and 24-hour online professional technical support to ensure your production line runs smoothly.

What is the repeatability of the dispensing system?

The system offers high-precision repeatability of ±0.025 mm (±25 Microns), making it ideal for micro-dispensing and semiconductor applications.

Does the software support industrial communication protocols?

Yes, the system is controlled by an industrial PC and supports the SECS/GEM protocol for seamless integration into smart factory environments.

Is the machine compatible with cleanroom environments?

Absolutely. It features an anti-static design (ESD protection) and low-particulate construction, making it suitable for ISO Class 5-8 cleanrooms.

What kind of maintenance does the nozzle require?

The system includes a standard vacuum cleaning device for the valve nozzle to prevent clogging and ensure consistent dispensing quality.