Advanced 355nm UV Laser System for PCB Depaneling

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Advanced 355nm UV Laser System for PCB Depaneling

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

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Product Description

Basic Information

Model NO.

UVC-01

Application

Automotive Industry, PCB

Cooling System

Water Cooling

Technical Class

Pulse Laser

Applicable Material

Metal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Laser Type

UV Laser

Wavelength

355 Nm

Min Beam Diameter

<10um

Output Power

15/20 Watts

Repetition Accuracy

3 μM

Origin

China

Product Description

355nm UV Laser Cutting Machine

Laser depaneling machine specifically designed for the PCB and related electronics industries. Utilizing a high-performance UV laser, it significantly minimizes the heat-affected zone (HAZ) for high-density PCBA products.

Equipped with self-developed control software, the system enables multi-panel cutting, auto-focusing, and shrinkage compensation for peak precision. High-precision motion controls, a scanning galvanometer, and a CCD positioning system ensure industry-leading accuracy.

The 355nm "cold marking" method ensures the laser beam diameter is only 20 μm after focusing. Pulse energy contacts the material in microseconds, preventing thermal damage to sensitive electronic components.

Technical Specifications

Parameter	Specification
Laser Type	UV Laser (355nm)
Beam Diameter	< 10µm
Pulse Frequency	10 – 200 kHz
Laser Power	15W / 20W
Cutting Thickness	0.004" – 0.07"
Repeat Accuracy	3μm
Marking Field Size	50mm × 50mm (1.96" × 1.96")
X-Y Travel Distance	400mm × 300mm (15.74" × 11.81")
Cooling System	Water-cooled
Laser Safety Class	Class I (FDA/CDRH compliant)
Dimensions (W×D×H)	1060mm × 1000mm × 1850mm

Key Features

Cold Processing Technology: The 355nm UV laser minimizes the heat-affected zone (HAZ) to prevent damage to sensitive assembly components.

Non-Contact Cutting: Eliminates mechanical stress, preventing deformation or warping of PCBs.

High Precision: Features 3μm repeatability supported by auto-focus and shrinkage compensation.

Wide Compatibility: Capable of cutting FR4, FR5, CEM, polyimide (PI), PTFE, ceramics, and more.

Burr-Free Edges: Clean cuts without debris, micro-dust, or micro-cracks.

Packing & Delivery

We provide comprehensive air-freight, sea-freight, and express services for our UV laser depaneling machines. Every unit is securely packed in reinforced wooden boxes to ensure safe international transit.

Manufacturing Excellence

Precision engineered solutions for advanced IC packaging, wafer processing, and device marking. Trusted for high repeatability, speed, and smart integration capabilities in automated assembly lines.

Frequently Asked Questions (FAQ)

What wavelength does the UV laser use, and why is it ideal for PCB depaneling?

The machine employs a 355nm UV laser, which provides "cold processing" with minimal thermal impact. The focused beam diameter of 20µm ensures micron-level precision without damaging adjacent components or materials.

What materials are compatible with this machine?

It supports a wide range of materials including Flexible/Rigid PCBs (FR4, FR5, CEM, polyimide, PTFE), non-conductive layers (Coverlay, CVL, ceramics, glass), and light etching or marking on metals like aluminum, brass, and copper.

What is the maximum cutting thickness?

The machine can efficiently cut materials ranging from 0.004" (0.1mm) up to 0.07" (1.78mm), with settings fully adjustable via the control software.

How accurate is the repeat positioning?

The system achieves a repetition accuracy of 3μm, ensuring consistent results for high-density and high-precision electronic assemblies.

Does the machine require specialized cooling?

Yes, the system utilizes a high-efficiency water-cooling method to maintain optimal laser performance and prolong the lifespan of the optical components.

Is the machine compatible with automated production lines?

Yes, the machine is SMEMA compatible, allowing for full integration into standard automated PCB assembly line processes.