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| Machine model | EP-15/25/30-THG-S |
| Laser wavelength | 355nm |
| Laser power | 4W / 7W / 10W /15W / 25W |
| Min. marking line width | 10µm-15µm |
| Marking speed | 250 characters/sec |
| Marking scope | 100*100mm |
| Standard lens | F160 |
| Pulse repetition frequency | 10-200kHz |
| Cooling mode | Water cooling |
| Power supply | AC 220V, 50Hz, 16A |
| Total power consumption | ≤1.5kW |
| Overall dimension | 800mm*950mm*1630mm |
Established in 2019, the business is mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently exported to over 30 countries, serving over 200 customers and suppliers worldwide. We aim to provide the most cost-effective products and ensure risk avoidance for our partners.
Main Products: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Annealing Machines, and Automatic Dicing Saw Machines.
Standard customized wooden box packaging to ensure equipment safety during international transport.