Focus Laser
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Automatic Double Head Cover Film Laser Cutting Machine
Revolutionize your PCB manufacturing process with our state-of-the-art Dual-Head Roll-to-Sheet Coating Film Laser Cutting Machine. Engineered specifically for the electronic circuit industry, this equipment replaces traditional mechanical punch die and solder mask backfill processes with advanced non-contact laser technology. It is the ultimate solution for high-volume, high-precision Coverlay/Overlayer cutting.
Precision Redefined for Flexible Circuit & Cover Film Cutting
| Parameter | Details |
|---|---|
| Laser Type | Nanosecond UV, Picosecond UV, Nanosecond green laser |
| Processing Area | 2 X 250mm X 500mm (customized) |
| Machine Dimensions | 2350mm X 1450mm X 2200mm |
| Processing Accuracy | ± 0.03mm |
| Total Power Consumption | 3 KW |
| Machine Weight | 2000 KG |
| Large Table size | 520mm x 2200mm |
| Environment | Temp: 22°C ± 2°C; Humidity: 30%~60% |
Ideal for cutting Coverlay, Overlayer, and protective films in:
Packing: 1 PCS per Wooden Case
Shipping Method: Primarily by sea due to weight (2500kg gross). Express available for urgent parts.
Delivery Time: Standard goods: 30-45 days; Customized goods: 45-60 days after deposit.
