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Home > FPC (Flexible PCB) Laser Cutting Equipment > High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
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High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing

High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing

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Product Description

Basic Information
StructureLaser Drilling Machine
LayoutVertical
Controlling ModeAutomatic
PrecisionHigh Precision
CertificationCE, RoHS, ISO 9001
Laser Heads4 Heads (Synchronous)
Efficiency Boost300% Higher Output
Transport PackageWooden Case
Automatic 4-Head Laser Drilling Machine

High-Efficiency Automatic 4-Head Roll-to-Roll Laser Drilling Machine

Product Description

Revolutionize Your Production with Unmatched Efficiency

Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment - the industry's first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.

Key Highlights
4-Head Synchronous Processing
Optimized Process
Picosecond UV Laser Source
4-Head Sync Processing

Massive 4X Efficiency Boost: Dramatically increase output and meet tight deadlines for large orders.

Plasma-Free Optimization

Laser parameters are fine-tuned to eliminate post-drilling plasma treatment, reducing process steps.

Picosecond UV Technology

Superior Hole Quality: No burrs, cracks, or thermal damage. Perfect for delicate materials like polyimide.

Precision & Efficiency Comparison
Precision Results
Efficiency Comparison Chart

Our drilling machine delivers exceptional microscopic accuracy. The 4-head system achieves significant reduction in production time and lower operational costs per unit compared to traditional single-head equipment.

Technical Specifications
Feature Specification
Laser Type Nanosecond UV, Picosecond UV, Picosecond Green Laser
Processing Area 550mm × 1500mm (customized)
Machine Size 7200mm × 2300mm × 2250mm
Processing Accuracy ±0.02mm
Machine Weight 8000 KG
Environment Requirements Humidity: 40% - 60% (no condensation); Temp: 22℃±2
Application Areas
Application Area
  • 🚀 PCB Industry: HDI PCBs, Multi-layer Boards, High-speed through-hole & blind via drilling.
  • 📱 Flexible Circuits: FPC, Flex-Rigid Boards, Polyimide cutting & drilling.
  • 🔬 Semiconductor: IC Substrates, Lead Frames, Ultra-fine micro-vias (≤0.05mm).
  • ⌚ Consumer Electronics: Smartphones, Wearables, Mass production solutions.
Packing & Delivery
Packaging
Packaging1PCS/Wooden Case
Standard Lead Time30-45 Days
Customized Lead Time45-90 Days
Frequently Asked Questions
What is the advantage of 4-head synchronous laser drilling?
The 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits while significantly reducing cycle time.
What is the machine's processing accuracy?
The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias at high speeds.
What materials are compatible with this equipment?
It is fully compatible with rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.
Does the system support automation and alignment?
Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.
How is beam quality maintained across multiple heads?
Our advanced beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality across the entire processing area.
What kind of after-sales support is available?
We provide a comprehensive warranty, technical training, installation assistance, and spare parts supply for 24/7 operation.

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