High-Precision Automated Glue Dispensing System with CCD Vision

Customization:	Available
After-sales Service:	Provided
Precision:	High Precision

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Basic Information

Condition:New

Certification:ISO

Warranty:12 Months

Automatic Grade:Automatic

Installation:Vertical

Driven Type:Electric

Product Name:Dispensing Machine

Feature 1:Guaranteed Quality

Feature 2:Customized According to Needs

After-Sale Service:Provided

Origin:China

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Product Description

High-Precision Automated Glue Dispensing System

Standard Features

Computer control with Windows OS
CCD visual positioning system
Servo motor with ball screw
Inline CCD visual programming or gerber upload
UPS and voltage stabilizer
ESD grounding point
CE certified

Optional Features

Heated valves for viscosity control
35 degree tilt and 360 degree rotation
PCB heater enhances material flow for underfill applications
Precision weight measurement ensures accurate volumetric dispensing
Multiple valves available: Pneumatic jet valve, Slide valve and Screw valve
Laser height detection to calibrate Z axis automatically

Product Advantages

Cost-effective with high-performance.
Non-contact injection valve for smaller dispensing diameter.
Improves reliability and consistency, increasing productivity.
Minimum overflow width of Underfill is only 0.2mm.
Recognize the chip body for higher accuracy than Mark point recognition.
Identity recognition and automatic program call for intelligent manufacturing.

Specifications	iJet-7H Dispensing Machine
Dimension (mm)	L790×W1600×H1600
Dispensing Area (mm)	Dual conveyors/Dual-valve: X:300 Y:200 Z:30 Single conveyor/Single-valve: X:380 Y:480 Z:30
Repeatability (mm)	±0.01
Maximum moving speed (mm/s)	1000
Maximum acceleration (g)	1.5
Standard configuration	Electrostatic interface; LED lighting; CCD visual positioning; 232 scanner socket; Lifting device
Optional configuration	Booster pump; UPS; Barcode scanner; Micro-balance (0.1mg); Laser altimetry (SICK); Dual valve; Dual conveyors; Four-direction tilt

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Exhibition & Customers

Main products include: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafer, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine (Wafer Packaging)), and Automatic Silicone Dispensing Equipment.

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Packaging & Shipping

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FAQ

Q1: How to choose a suitable machine? A1: You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q2: What is the warranty period for the equipment? A2: We provide a one-year warranty and 24 hours online professional technical support to ensure your production remains uninterrupted.

Q3: Does the machine support CCD visual positioning? A3: Yes, our dispensing machines come standard with a high-precision CCD visual positioning system for accurate material alignment.

Q4: Can the dispensing valve be customized? A4: Yes, we offer multiple valve options including Pneumatic jet valves, Slide valves, and Screw valves to suit different material viscosities.

Q5: What is the lead time for delivery? A5: Delivery time depends on the specific configuration and customization requirements. Generally, standard models are shipped within 4-6 weeks.

Q6: Do you provide installation and training? A6: Yes, we provide comprehensive technical support, including operation manuals and remote or on-site guidance for installation and software training.